Junnosuke Sekiguchi

Person

Kitaibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Nickel-iron alloy plating solution
- Patent number 9,234,292
- Issue date Jan 12, 2016
- JX Nippon Mining & Metals Corporation
- Masaomi Murakami
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Sputtering target and process for producing same
- Patent number 9,034,154
- Issue date May 19, 2015
- JX Nippon Mining & Metals Corporation
- Yuichiro Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Aqueous solution containing divalent iron ions
- Patent number 8,734,579
- Issue date May 27, 2014
- JX Nippon Mining & Metals Corporation
- Masaomi Murakami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate and manufacturing method therefor
- Patent number 8,736,057
- Issue date May 27, 2014
- Nippon Mining & Metals Co., Ltd.
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating solution
- Patent number 8,404,035
- Issue date Mar 26, 2013
- Nippon Mining & Metals Co., Ltd.
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated article having metal thin film formed by electroless plating
- Patent number 8,394,508
- Issue date Mar 12, 2013
- Nippon Mining & Metals Co., Ltd.
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate comprising alloy film of metal element having barrier fun...
- Patent number 8,395,264
- Issue date Mar 12, 2013
- JX Nippon Mining & Metals Corporation
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
ULSI micro-interconnect member having ruthenium electroplating laye...
- Patent number 8,390,123
- Issue date Mar 5, 2013
- Nippon Mining & Metals Co., Ltd
- Junnosuke Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High-purity aqueous copper sulfonate solution and method of produci...
- Patent number 8,333,834
- Issue date Dec 18, 2012
- JX Nippon Mining & Metals Corporation
- Junnosuke Sekiguchi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Plated product having copper thin film formed thereon by electroles...
- Patent number 8,283,051
- Issue date Oct 9, 2012
- JX Nippon Mining & Metals Corporation
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate and manufacturing method therefor
- Patent number 8,247,301
- Issue date Aug 21, 2012
- Nippon Mining & Metals Co., Ltd.
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for electroless plating and metal-plated article
- Patent number 8,182,873
- Issue date May 22, 2012
- Nippon Mining & Metals Co., Ltd
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated article having metal thin film formed by electroless plating...
- Patent number 8,163,400
- Issue date Apr 24, 2012
- Nippon Mining & Metals Co., Ltd
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component formed with barrier-seed layer on base material
- Patent number 8,089,154
- Issue date Jan 3, 2012
- Nippon Mining & Metals Co., Ltd
- Junnosuke Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component formed with barrier-seed layer on base material
- Patent number 8,004,082
- Issue date Aug 23, 2011
- Nippon Mining & Metals Co., Ltd
- Junnosuke Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of surface treatment using imidazole compound
- Patent number 7,968,150
- Issue date Jun 28, 2011
- Nippon Mining & Metals Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrolytic copper plating method, pure copper anode for electroly...
- Patent number 7,943,033
- Issue date May 17, 2011
- JX Nippon Mining & Metals Corporation
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic copper plating method, pure copper anode for electroly...
- Patent number 7,799,188
- Issue date Sep 21, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electroplating method, pure copper anode for copper electrop...
- Patent number 7,648,621
- Issue date Jan 19, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroless plating method and semiconductor wafer on which metal p...
- Patent number 7,179,741
- Issue date Feb 20, 2007
- Nikko Materials Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrolytic copper plating method, phosphorous copper anode for el...
- Patent number 7,138,040
- Issue date Nov 21, 2006
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal plating method, pretreatment agent, and semiconductor wafer a...
- Patent number 7,045,461
- Issue date May 16, 2006
- Nikkon Materials Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROW...
- Publication number 20140158546
- Publication date Jun 12, 2014
- JX Nippon Mining & Metals Corporation
- Junnosuke SEKIGUCHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Recovery Method for High Purity Platinum
- Publication number 20130139648
- Publication date Jun 6, 2013
- JX NIPPON MINING & METALS CORPORATION
- Junnosuke Sekiguchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HIGH-PURITY AQUEOUS COPPER SULFONATE SOLUTION AND METHOD OF PRODUCI...
- Publication number 20120174827
- Publication date Jul 12, 2012
- Junnosuke Sekiguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NICKEL-IRON ALLOY PLATING SOLUTION
- Publication number 20120118747
- Publication date May 17, 2012
- Masaomi Murakami
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
AQUEOUS SOLUTION CONTAINING DIVALENT IRON IONS
- Publication number 20120103229
- Publication date May 3, 2012
- JX NIPPON MINING & METALS CORPORATION
- Masaomi Murakami
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROW...
- Publication number 20120103820
- Publication date May 3, 2012
- Junnosuke Sekiguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate comprising alloy film of metal element having barrier fun...
- Publication number 20110241209
- Publication date Oct 6, 2011
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputtering Target and Process for Producing Same
- Publication number 20110162971
- Publication date Jul 7, 2011
- JX NIPPON MINING & METALS CORPORATION
- Yuichiro Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATED PRODUCT HAVING COPPER THIN FILM FORMED THEREON BY ELECTROLES...
- Publication number 20110129688
- Publication date Jun 2, 2011
- Junichi Ito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC COMPONENT FORMED WITH BARRIER-SEED LAYER ON BASE MATERIAL
- Publication number 20110006426
- Publication date Jan 13, 2011
- Junnosuke Sekiguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC COMPONENT FORMED WITH BARRIER-SEED LAYER ON BASE MATERIAL
- Publication number 20110006427
- Publication date Jan 13, 2011
- Junnosuke Sekiguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ULSI MICRO-INTERCONNECT MEMBER HAVING RUTHENIUM ELECTROPLATING LAYE...
- Publication number 20100314766
- Publication date Dec 16, 2010
- Junnosuke Sekiguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...
- Publication number 20100307923
- Publication date Dec 9, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20100244258
- Publication date Sep 30, 2010
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20100244259
- Publication date Sep 30, 2010
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plated article having metal thin film formed by electroless plating...
- Publication number 20100038111
- Publication date Feb 18, 2010
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...
- Publication number 20100000871
- Publication date Jan 7, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plated article having metal thin film formed by electroless plating...
- Publication number 20100003539
- Publication date Jan 7, 2010
- Atsushi Yabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of surface treatment using imidazole compound
- Publication number 20090068364
- Publication date Mar 12, 2009
- Nikko Materials Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for forming a seed layer for damascene copper wiring, and se...
- Publication number 20080224313
- Publication date Sep 18, 2008
- Atsushi Yabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless copper plating solution and electroless copper plating...
- Publication number 20070071904
- Publication date Mar 29, 2007
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless copper plating solution
- Publication number 20070042125
- Publication date Feb 22, 2007
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for electroless plating and metal-plated article
- Publication number 20060233963
- Publication date Oct 19, 2006
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Novel imidazole alcohol compound, process for producing the same, a...
- Publication number 20060135584
- Publication date Jun 22, 2006
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of electroless plating and semiconductor wafer having metal...
- Publication number 20040235294
- Publication date Nov 25, 2004
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper electroplating method, pure copper anode for copper electrop...
- Publication number 20040200727
- Publication date Oct 14, 2004
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal plating method, pretreatment agent, and semiconductor wafer a...
- Publication number 20040182714
- Publication date Sep 23, 2004
- Nikko Materials Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrolytic copper plating method, phosphorous copper anode for el...
- Publication number 20040007474
- Publication date Jan 15, 2004
- Takeo Okabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Junnosuke Sekiguchi

Person

Patents Grantslast 30 patents

Nickel-iron alloy plating solution

Sputtering target and process for producing same

Aqueous solution containing divalent iron ions

Substrate and manufacturing method therefor

Electroless copper plating solution

Plated article having metal thin film formed by electroless plating

Substrate comprising alloy film of metal element having barrier fun...

ULSI micro-interconnect member having ruthenium electroplating laye...

High-purity aqueous copper sulfonate solution and method of produci...

Plated product having copper thin film formed thereon by electroles...

Substrate and manufacturing method therefor

Method for electroless plating and metal-plated article

Plated article having metal thin film formed by electroless plating...

Electronic component formed with barrier-seed layer on base material

Electronic component formed with barrier-seed layer on base material

Method of surface treatment using imidazole compound

Electrolytic copper plating method, pure copper anode for electroly...

Electrolytic copper plating method, pure copper anode for electroly...

Copper electroplating method, pure copper anode for copper electrop...

Electroless plating method and semiconductor wafer on which metal p...

Electrolytic copper plating method, phosphorous copper anode for el...

Metal plating method, pretreatment agent, and semiconductor wafer a...

Patents Applicationslast 30 patents

ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROW...

Recovery Method for High Purity Platinum

HIGH-PURITY AQUEOUS COPPER SULFONATE SOLUTION AND METHOD OF PRODUCI...

NICKEL-IRON ALLOY PLATING SOLUTION

AQUEOUS SOLUTION CONTAINING DIVALENT IRON IONS

ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROW...

Substrate comprising alloy film of metal element having barrier fun...

Sputtering Target and Process for Producing Same

PLATED PRODUCT HAVING COPPER THIN FILM FORMED THEREON BY ELECTROLES...

ELECTRONIC COMPONENT FORMED WITH BARRIER-SEED LAYER ON BASE MATERIAL

ELECTRONIC COMPONENT FORMED WITH BARRIER-SEED LAYER ON BASE MATERIAL

ULSI MICRO-INTERCONNECT MEMBER HAVING RUTHENIUM ELECTROPLATING LAYE...

Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...

SUBSTRATE AND MANUFACTURING METHOD THEREFOR

SUBSTRATE AND MANUFACTURING METHOD THEREFOR

Plated article having metal thin film formed by electroless plating...

Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...

Plated article having metal thin film formed by electroless plating...

Method of surface treatment using imidazole compound

Method for forming a seed layer for damascene copper wiring, and se...

Electroless copper plating solution and electroless copper plating...

Electroless copper plating solution

Method for electroless plating and metal-plated article

Novel imidazole alcohol compound, process for producing the same, a...

Method of electroless plating and semiconductor wafer having metal...

Copper electroplating method, pure copper anode for copper electrop...

Metal plating method, pretreatment agent, and semiconductor wafer a...

Electrolytic copper plating method, phosphorous copper anode for el...