Junpei Fujiwara

Person

Isesaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Layered sheet, container, carrier tape, and electronic component pa...
- Patent number 12,154,818
- Issue date Nov 26, 2024
- DENKA COMPANY LIMITED
- Yuko Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered sheet, container, carrier tape, and electronic component pa...
- Patent number 12,119,255
- Issue date Oct 15, 2024
- DENKA COMPANY LIMITED
- Yuko Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic resin sheet having hairlike bodies and molded product...
- Patent number 12,036,715
- Issue date Jul 16, 2024
- DENKA COMPANY LIMITED
- Keishi Maeda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Thermoplastic resin sheet having hairlike bodies and molded product...
- Patent number 11,904,518
- Issue date Feb 20, 2024
- DENKA COMPANY LIMITED
- Junpei Fujiwara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Layered sheet, electronic component packaging container, and electr...
- Patent number 11,701,874
- Issue date Jul 18, 2023
- DENKA COMPANY LIMITED
- Ryosuke Yanaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin sheet having capillaceous bodies and molded product thereof
- Patent number 11,623,424
- Issue date Apr 11, 2023
- DENKA COMPANY LIMITED
- Junpei Fujiwara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic component packaging sheet, and formed article thereof
- Patent number 10,202,506
- Issue date Feb 12, 2019
- DENKA COMPANY LIMITED
- Junpei Fujiwara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Water-repellent, thermoplastic resin sheet, and molded article
- Patent number 10,137,660
- Issue date Nov 27, 2018
- DENKA COMPANY LIMITED
- Junpei Fujiwara
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Water-repellent, thermoplastic resin sheet, and molded article
- Patent number 9,908,311
- Issue date Mar 6, 2018
- DENKA COMPANY LIMITED
- Junpei Fujiwara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Laminated sheet for packaging electronic component and molded body...
- Patent number 9,028,939
- Issue date May 12, 2015
- Denki Kagaku Kogyo Kabushiki Kaisha
- Junpei Fujiwara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Styrene resin composition, and molded article thereof
- Patent number 9,028,938
- Issue date May 12, 2015
- Denki Kagaku Kogyo Kabushiki Kaisha
- Junpei Fujiwara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Surface conductive laminated sheet and electronic part packaging co...
- Patent number 8,999,470
- Issue date Apr 7, 2015
- Denki Kagaku Kogyo Kabushiki Kaisha
- Junpei Fujiwara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
LAYERED SHEET, CONTAINER, CARRIER TAPE, AND ELECTRONIC COMPONENT PA...
- Publication number 20230084488
- Publication date Mar 16, 2023
- Denka Company Limited
- Yuko FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED SHEET, ELECTRONIC COMPONENT PACKAGING CONTAINER, AND ELECTR...
- Publication number 20220194067
- Publication date Jun 23, 2022
- DENKA COMPANY LIMITED
- Ryosuke YANAKA
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER FILM AND HEAT-RESISTANT ADHESIVE TAPE
- Publication number 20210130653
- Publication date May 6, 2021
- Denka Company Limited
- Junpei Fujiwara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOPLASTIC RESIN SHEET HAVING HAIRLIKE BODIES AND MOLDED PRODUCT...
- Publication number 20200368956
- Publication date Nov 26, 2020
- DENKA COMPANY LIMITED
- Keishi MAEDA
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN SHEET HAVING CAPILLACEOUS BODIES AND MOLDED PRODUCT THEREOF
- Publication number 20200215787
- Publication date Jul 9, 2020
- DENKA COMPANY LIMITED
- Junpei FUJIWARA
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOPLASTIC RESIN SHEET HAVING HAIRLIKE BODIES AND MOLDED PRODUCT...
- Publication number 20190283301
- Publication date Sep 19, 2019
- Denka Company Limited
- Junpei FUJIWARA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WATER-REPELLENT, THERMOPLASTIC RESIN SHEET, AND MOLDED ARTICLE
- Publication number 20150314554
- Publication date Nov 5, 2015
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Junpei FUJIWARA
- B32 - LAYERED PRODUCTS
Information Patent Application
WATER-REPELLENT, THERMOPLASTIC RESIN SHEET, AND MOLDED ARTICLE
- Publication number 20150306852
- Publication date Oct 29, 2015
- Denki Kagaku Kogyo Kabushiki Kaisha
- Junpei FUJIWARA
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATED SHEET FOR PACKAGING ELECTRONIC COMPONENT AND MOLDED BODY...
- Publication number 20130295307
- Publication date Nov 7, 2013
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Junpei Fujiwara
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF
- Publication number 20130209748
- Publication date Aug 15, 2013
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Junpei Fujiwara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
STYRENE RESIN COMPOSITION, AND MOLDED ARTICLE THEREOF
- Publication number 20130209742
- Publication date Aug 15, 2013
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Junpei Fujiwara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF
- Publication number 20130189496
- Publication date Jul 25, 2013
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Junpei Fujiwara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SURFACE CONDUCTIVE LAMINATED SHEET AND ELECTRONIC PART PACKAGING CO...
- Publication number 20130017350
- Publication date Jan 17, 2013
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Junpei Fujiwara
- B32 - LAYERED PRODUCTS

Junpei Fujiwara

Person

Patents Grantslast 30 patents

Layered sheet, container, carrier tape, and electronic component pa...

Layered sheet, container, carrier tape, and electronic component pa...

Thermoplastic resin sheet having hairlike bodies and molded product...

Thermoplastic resin sheet having hairlike bodies and molded product...

Layered sheet, electronic component packaging container, and electr...

Resin sheet having capillaceous bodies and molded product thereof

Electronic component packaging sheet, and formed article thereof

Water-repellent, thermoplastic resin sheet, and molded article

Water-repellent, thermoplastic resin sheet, and molded article

Laminated sheet for packaging electronic component and molded body...

Styrene resin composition, and molded article thereof

Surface conductive laminated sheet and electronic part packaging co...

Patents Applicationslast 30 patents

LAYERED SHEET, CONTAINER, CARRIER TAPE, AND ELECTRONIC COMPONENT PA...

LAYERED SHEET, ELECTRONIC COMPONENT PACKAGING CONTAINER, AND ELECTR...

MULTILAYER FILM AND HEAT-RESISTANT ADHESIVE TAPE

THERMOPLASTIC RESIN SHEET HAVING HAIRLIKE BODIES AND MOLDED PRODUCT...

RESIN SHEET HAVING CAPILLACEOUS BODIES AND MOLDED PRODUCT THEREOF

THERMOPLASTIC RESIN SHEET HAVING HAIRLIKE BODIES AND MOLDED PRODUCT...

WATER-REPELLENT, THERMOPLASTIC RESIN SHEET, AND MOLDED ARTICLE

WATER-REPELLENT, THERMOPLASTIC RESIN SHEET, AND MOLDED ARTICLE

LAMINATED SHEET FOR PACKAGING ELECTRONIC COMPONENT AND MOLDED BODY...

ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF

STYRENE RESIN COMPOSITION, AND MOLDED ARTICLE THEREOF

ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF

SURFACE CONDUCTIVE LAMINATED SHEET AND ELECTRONIC PART PACKAGING CO...