Junrong Yan

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Mold compound dispensing system and method
- Patent number 12,083,715
- Issue date Sep 10, 2024
- Morgan, Lewis & Bockius LLP
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding for semiconductor devices
- Patent number 11,901,327
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device with side grooves
- Patent number 11,894,343
- Issue date Feb 6, 2024
- Western Digital Technologies, Inc.
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped interconnector for stacked die package
- Patent number 11,756,932
- Issue date Sep 12, 2023
- SanDisk Technologies LLC
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including vertical wire bonds
- Patent number 11,749,647
- Issue date Sep 5, 2023
- Western Digital Technologies, Inc.
- Xiaofeng Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aperture structure on semiconductor component backside to alleviate...
- Patent number 11,289,395
- Issue date Mar 29, 2022
- Western Digital Technologies, Inc.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with top die positioned to reduce die cracking
- Patent number 11,177,241
- Issue date Nov 16, 2021
- Western Digital Technologies, Inc.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including dual pad wire bond interconnection
- Patent number 10,483,239
- Issue date Nov 19, 2019
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including corner recess
- Patent number 10,418,334
- Issue date Sep 17, 2019
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Hang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including conductive bump interconnections
- Patent number 10,283,485
- Issue date May 7, 2019
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including die bond pads at a die edge
- Patent number 10,128,218
- Issue date Nov 13, 2018
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer layer for embedding semiconductor die
- Patent number 9,462,694
- Issue date Oct 4, 2016
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER THINNED BY HORIZONTAL STEALTH LASING
- Publication number 20230411169
- Publication date Dec 21, 2023
- Western Digital Technologies, Inc.
- Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer Dicing Method
- Publication number 20230402323
- Publication date Dec 14, 2023
- Western Digital Technologies, Inc.
- Zhengjie ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold Compound Dispensing System and Method
- Publication number 20230173720
- Publication date Jun 8, 2023
- Western Digital Technologies, Inc.
- Xianlu Cui
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE WITH SIDE GROOVES
- Publication number 20220375899
- Publication date Nov 24, 2022
- Western Digital Technologies, Inc.
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDUCED STRESS DIE PICK AND PLACE
- Publication number 20220181208
- Publication date Jun 9, 2022
- Western Digital Technologies, Inc.
- Xin Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding For Semiconductor Devices
- Publication number 20220052014
- Publication date Feb 17, 2022
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOPED INTERCONNECTOR FOR STACKED DIE PACKAGE
- Publication number 20210407967
- Publication date Dec 30, 2021
- Western Digital Technologies, Inc.
- XIANLU CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS
- Publication number 20210366875
- Publication date Nov 25, 2021
- Western Digital Technologies, Inc.
- Xiaofeng Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TOP DIE POSITIONED TO REDUCE DIE CRACKING
- Publication number 20200381401
- Publication date Dec 3, 2020
- Western Digital Technologies, Inc.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APERTURE STRUCTURE ON SEMICONDUCTOR COMPONENT BACKSIDE TO ALLEVIATE...
- Publication number 20200335481
- Publication date Oct 22, 2020
- Western Digital Technologies, Inc.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMP INTERCONNECTIONS
- Publication number 20180337161
- Publication date Nov 22, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DUAL PAD WIRE BOND INTERCONNECTION
- Publication number 20180190621
- Publication date Jul 5, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CORNER RECESS
- Publication number 20180174983
- Publication date Jun 21, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Hang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DIE BOND PADS AT A DIE EDGE
- Publication number 20180175006
- Publication date Jun 21, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20170179101
- Publication date Jun 22, 2017
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER LAYER FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20150187421
- Publication date Jul 2, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- G11 - INFORMATION STORAGE
Information Patent Application
BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20150155247
- Publication date Jun 4, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS

Junrong Yan

Person

Patents Grantslast 30 patents

Mold compound dispensing system and method

Wire bonding for semiconductor devices

Vertical semiconductor device with side grooves

Sloped interconnector for stacked die package

Semiconductor device including vertical wire bonds

Aperture structure on semiconductor component backside to alleviate...

Semiconductor device with top die positioned to reduce die cracking

Semiconductor device including dual pad wire bond interconnection

Semiconductor device including corner recess

Semiconductor device including conductive bump interconnections

Semiconductor device including die bond pads at a die edge

Spacer layer for embedding semiconductor die

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER THINNED BY HORIZONTAL STEALTH LASING

Semiconductor Wafer Dicing Method

Mold Compound Dispensing System and Method

VERTICAL SEMICONDUCTOR DEVICE WITH SIDE GROOVES

SEMICONDUCTOR DEVICE WITH REDUCED STRESS DIE PICK AND PLACE

Wire Bonding For Semiconductor Devices

SLOPED INTERCONNECTOR FOR STACKED DIE PACKAGE

SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS

SEMICONDUCTOR DEVICE WITH TOP DIE POSITIONED TO REDUCE DIE CRACKING

APERTURE STRUCTURE ON SEMICONDUCTOR COMPONENT BACKSIDE TO ALLEVIATE...

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMP INTERCONNECTIONS

SEMICONDUCTOR DEVICE INCLUDING DUAL PAD WIRE BOND INTERCONNECTION

SEMICONDUCTOR DEVICE INCLUDING CORNER RECESS

SEMICONDUCTOR DEVICE INCLUDING DIE BOND PADS AT A DIE EDGE

BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE

SPACER LAYER FOR EMBEDDING SEMICONDUCTOR DIE

BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE