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Junshi Yoshioka
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Saitama, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Surface-treated electro-deposited copper foil and method for manufa...
Patent number
8,715,836
Issue date
May 6, 2014
Mitsui Mining & Smelting Co., Ltd.
Makoto Dobashi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of preparing electrolytic copper solution acidified with sul...
Patent number
8,419,920
Issue date
Apr 16, 2013
Mitsui Mining & Smelting Co., Ltd.
Sakiko Tomonaga
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method of manufacturing electrodeposited copper foil with carrier f...
Patent number
7,217,464
Issue date
May 15, 2007
Mitsui Mining & Smelting Co., Ltd.
Akitoshi Takanashi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electrolyte copper foil having carrier foil, manufacturing method t...
Patent number
6,984,453
Issue date
Jan 10, 2006
Mitsui Mining & Smelting Co., Ltd.
Akiko Sugimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electolytic copper foil with carrier foil and method for manufactur...
Patent number
6,610,418
Issue date
Aug 26, 2003
Mitsui Mining & Smelting Co., Ltd.
Junshi Yoshioka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electrolytic copper foil with carrier foil and copper-clad laminate...
Patent number
6,541,126
Issue date
Apr 1, 2003
Mitsui Mining & Smelting Co., Ltd.
Junshi Yoshioka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Making and using an ultra-thin copper foil
Patent number
6,270,889
Issue date
Aug 7, 2001
Mitsui Mining & Smelting Co., Ltd.
Takashi Kataoka
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Composite foil of aluminum and copper
Patent number
6,183,880
Issue date
Feb 6, 2001
Mitsui Mining & Smelting Co., Ltd.
Junshi Yoshioka
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Organic rust-proof treated copper foil
Patent number
6,071,629
Issue date
Jun 6, 2000
Mitsui Mining and Smelting Co., Ltd.
Toshiko Yokota
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF PREPARING ELECTROLYTIC COPPER SOLUTION ACIDIFIED WITH SUL...
Publication number
20100089758
Publication date
Apr 15, 2010
Mitsui Mining and Smelting Co., Ltd.
Sakiko Tomonaga
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PRODUCTION METHOD OF ELECTRO-DEPOSITED COPPER FOIL, ELECTRO-DEPOSIT...
Publication number
20090166213
Publication date
Jul 2, 2009
Mitsui Mining and Smelting Co., Ltd.
Makoto Dobashi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SURFACE-TREATED ELECTRO-DEPOSITED COPPER FOIL AND METHOD FOR MANUFA...
Publication number
20090047539
Publication date
Feb 19, 2009
Mitsui Mining and Smelting Co., Ltd.
Makoto Dobashi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Copper foil with carrier foil, process for producing the same and c...
Publication number
20040188263
Publication date
Sep 30, 2004
Akiko Sugimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Process for producing high temperature heat resisting carrier foil...
Publication number
20040170858
Publication date
Sep 2, 2004
Akitoshi Takanashi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Electrolyte copper foil having carrier foil, manufacturing method t...
Publication number
20040067377
Publication date
Apr 8, 2004
Akiko Sugimoto
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR