Junso PAK

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including a dualized signal wiring structure
- Patent number 12,224,260
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Heejung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving power integrity characteristics
- Patent number 12,213,256
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Junghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including dual stiffener
- Patent number 11,908,758
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid semiconductor device and electronic device
- Patent number 11,908,810
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157867
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132271
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Kyojin Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING POWER INTEGRITY CHARACTERISTICS
- Publication number 20220361339
- Publication date Nov 10, 2022
- Samsung Electronics Co., Ltd.
- Junghwa KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DUAL STIFFENER
- Publication number 20220208624
- Publication date Jun 30, 2022
- Samsung Electronics Co., Ltd.
- HEUNGKYU KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUALIZED SIGNAL WIRING STRUCTURE
- Publication number 20220181288
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Heejung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20220181274
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- HEUNGKYU KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES
- Publication number 20210028100
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- Junso PAK
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package including a dualized signal wiring structure

Semiconductor package for improving power integrity characteristics

Semiconductor package including dual stiffener

Hybrid semiconductor device and electronic device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE FOR IMPROVING POWER INTEGRITY CHARACTERISTICS

SEMICONDUCTOR PACKAGE INCLUDING DUAL STIFFENER

SEMICONDUCTOR PACKAGE INCLUDING A DUALIZED SIGNAL WIRING STRUCTURE

HYBRID SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

STACK PACKAGES