JUNWOO PARK

Person

SUWON-SI, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having package substrate
- Patent number 12,205,925
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and authentication method in electronic device
- Patent number 11,843,947
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Donghyun Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package
- Patent number 11,133,296
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Chanhee Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,622,340
- Issue date Apr 14, 2020
- Samsung Electronics Co., Ltd.
- Chanhee Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a molding layer including a molding ca...
- Patent number 10,361,177
- Issue date Jul 23, 2019
- Samsung Electronics Co., Ltd.
- Yun-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MOLDING APPARATUS AND COMPRESSION MOLDING METHOD USIN...
- Publication number 20240420972
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128190
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PROTECTION DEVICE
- Publication number 20240096748
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME
- Publication number 20240079342
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230411259
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Sunchul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230395482
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Jungjoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME
- Publication number 20230378094
- Publication date Nov 23, 2023
- Samsung Electronics Co., Ltd.
- Junwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING FIXING MEMBERS
- Publication number 20230260926
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND AUTHENTICATION METHOD IN ELECTRONIC DEVICE
- Publication number 20230147815
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Donghyun CHO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MOLDED PRODUCT FOR SEMICONDUCTOR STRIP AND METHOD OF MANUFACTURING...
- Publication number 20230127641
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Seunghwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230131730
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Junwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ELECTROMAGNETIC SHIELD STRUCTURE
- Publication number 20230114892
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- JONGWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230082412
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SETTING UP NETWORK LOCK FUNCTION OF ELECTRONIC DEVICE AND...
- Publication number 20230018495
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- Donghyun CHO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220415778
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- JUNWOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE
- Publication number 20220367416
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200098734
- Publication date Mar 26, 2020
- Samsung Electronics Co., Ltd.
- CHANHEE JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20190067258
- Publication date Feb 28, 2019
- Samsung Electronics Co., Ltd.
- Yun-Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20180145061
- Publication date May 24, 2018
- Samsung Electronics Co., Ltd.
- CHANHEE JEONG
- H01 - BASIC ELECTRIC ELEMENTS

JUNWOO PARK

Person

Patents Grantslast 30 patents

Semiconductor package having package substrate

Electronic device and authentication method in electronic device

Semiconductor package

Semiconductor package

Semiconductor package having a molding layer including a molding ca...

Patents Applicationslast 30 patents

SEMICONDUCTOR MOLDING APPARATUS AND COMPRESSION MOLDING METHOD USIN...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP PROTECTION DEVICE

SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME

SEMICONDUCTOR PACKAGES HAVING FIXING MEMBERS

ELECTRONIC DEVICE AND AUTHENTICATION METHOD IN ELECTRONIC DEVICE

MOLDED PRODUCT FOR SEMICONDUCTOR STRIP AND METHOD OF MANUFACTURING...

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING ELECTROMAGNETIC SHIELD STRUCTURE

SEMICONDUCTOR PACKAGE

METHOD OF SETTING UP NETWORK LOCK FUNCTION OF ELECTRONIC DEVICE AND...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE