Junxin Wang

Person

Chandler, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
POROUS POLYMER DIELECTRIC LAYER ON CORE
- Publication number 20240113009
- Publication date Apr 4, 2024
- Intel Corporation
- Whitney Bryks
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...
- Publication number 20230395445
- Publication date Dec 7, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...
- Publication number 20230395467
- Publication date Dec 7, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAVEGUIDE FORMED WITHIN IN A GLASS LAYER
- Publication number 20230091834
- Publication date Mar 23, 2023
- Intel Corporation
- Bainye Francoise ANGOUA
- G02 - OPTICS
Information Patent Application
MULTI LAYER PACKAGE SUBSTRATE HAVING DIFFERENT DIELECTRIC MATERIALS...
- Publication number 20230090188
- Publication date Mar 23, 2023
- Intel Corporation
- Junxin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRAT...
- Publication number 20230086881
- Publication date Mar 23, 2023
- Intel Corporation
- Whitney BRYKS
- G02 - OPTICS
Information Patent Application
COMPOSITE IC DIE PACKAGE INCLUDING IC DIE DIRECTLY BONDED TO FRONT...
- Publication number 20230034737
- Publication date Feb 2, 2023
- Intel Corporation
- Junxin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATES HAVING HETEROGENEOUS DIELECTRIC LAYERS
- Publication number 20220139792
- Publication date May 5, 2022
- Intel Corporation
- Joshua Stacey
- H01 - BASIC ELECTRIC ELEMENTS

Junxin Wang

Person

Patents Applicationslast 30 patents

POROUS POLYMER DIELECTRIC LAYER ON CORE

GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...

GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...

OPTICAL WAVEGUIDE FORMED WITHIN IN A GLASS LAYER

MULTI LAYER PACKAGE SUBSTRATE HAVING DIFFERENT DIELECTRIC MATERIALS...

DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRAT...

COMPOSITE IC DIE PACKAGE INCLUDING IC DIE DIRECTLY BONDED TO FRONT...

ELECTRONIC SUBSTRATES HAVING HETEROGENEOUS DIELECTRIC LAYERS