Junya Sagara

Person

Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and adhesive sheet
- Patent number 8,294,282
- Issue date Oct 23, 2012
- Kabushiki Kaisha Toshiba
- Hidekazu Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 8,231,046
- Issue date Jul 31, 2012
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a stacked semiconductor package, and stack...
- Patent number 7,932,162
- Issue date Apr 26, 2011
- Kabushiki Kaisha Toshiba
- Junya Sagara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor chips stacked and mounted...
- Patent number 7,892,890
- Issue date Feb 22, 2011
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 7,849,897
- Issue date Dec 14, 2010
- Kabushiki Kaisha Toshiba
- Shoko Omizo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device having semiconductor chips stacked and mounted...
- Patent number 7,675,153
- Issue date Mar 9, 2010
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,569,921
- Issue date Aug 4, 2009
- Kabushiki Kaisha Toshiba
- Noboru Okane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...
- Publication number 20110163459
- Publication date Jul 7, 2011
- Kabushiki Kaisha Toshiba
- Junya SAGARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ADHESIVE SHEET
- Publication number 20110068480
- Publication date Mar 24, 2011
- Hidekazu Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20100311224
- Publication date Dec 9, 2010
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20100181367
- Publication date Jul 22, 2010
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIPS STACKED AND MOUNTED...
- Publication number 20100112755
- Publication date May 6, 2010
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...
- Publication number 20090096110
- Publication date Apr 16, 2009
- Kabushiki Kaisha Toshiba
- Junya SAGARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for manufacturing semiconductor device
- Publication number 20080110546
- Publication date May 15, 2008
- Shoko Omizo
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20080099532
- Publication date May 1, 2008
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and manufacturing method thereof
- Publication number 20070023875
- Publication date Feb 1, 2007
- KABUSHIKI KAISHA TOSHIBA
- Noboru Okane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20070023922
- Publication date Feb 1, 2007
- KABUSHIKI KAISHA TOSHIBA
- Noboru Okane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060232288
- Publication date Oct 19, 2006
- KABUSHIKI KAISHA TOSHIBA
- Noboru Okane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having semiconductor chips stacked and mounted...
- Publication number 20060175697
- Publication date Aug 10, 2006
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS

Junya Sagara

Person

Patents Grantslast 30 patents

Semiconductor device and adhesive sheet

Wire bonding apparatus and wire bonding method

Method for manufacturing a stacked semiconductor package, and stack...

Semiconductor device having semiconductor chips stacked and mounted...

Apparatus and method for manufacturing semiconductor device

Semiconductor device having semiconductor chips stacked and mounted...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...

SEMICONDUCTOR DEVICE AND ADHESIVE SHEET

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIPS STACKED AND MOUNTED...

METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...

Apparatus and method for manufacturing semiconductor device

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

Semiconductor package and manufacturing method thereof

Semiconductor package

Semiconductor device and manufacturing method thereof

Semiconductor device having semiconductor chips stacked and mounted...