Junyan TANG

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vertically transitioning between substrate integrated waveguides (S...
- Patent number 11,658,378
- Issue date May 23, 2023
- International Business Machines Corporation
- Joshua C. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB with substrate integrated waveguides using multi-band monopole...
- Patent number 11,399,428
- Issue date Jul 26, 2022
- International Business Machines Corporation
- Pavel Roy Paladhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded filtering in PCB integrated ultra high speed dielectric wa...
- Patent number 10,879,575
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Joshua Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Communication system having a multi-layer PCB including a dielectri...
- Patent number 10,199,706
- Issue date Feb 5, 2019
- International Business Machines Corporation
- Samuel R. Connor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduction of crosstalk between dielectric waveguides using split ri...
- Patent number 10,181,628
- Issue date Jan 15, 2019
- International Business Machines Corporation
- Daniel M. Dreps
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board having first and second coaxial v...
- Patent number 10,141,623
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Samuel R. Connor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION...
- Publication number 20240321802
- Publication date Sep 26, 2024
- International Business Machines Corporation
- JUNYAN TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY
- Publication number 20240234284
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Francesco PREDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY
- Publication number 20240136270
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Francesco PREDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT
- Publication number 20230420394
- Publication date Dec 28, 2023
- International Business Machines Corporation
- Anil Yuksel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB WITH SUBSTRATE INTEGRATED WAVEGUIDES USING MULTI-BAND MONOPOLE...
- Publication number 20210112655
- Publication date Apr 15, 2021
- International Business Machines Corporation
- PAVEL ROY PALADHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY TRANSITIONING BETWEEN SUBSTRATE INTEGRATED WAVEGUIDES (S...
- Publication number 20210111472
- Publication date Apr 15, 2021
- International Business Machines Corporation
- JOSHUA C. MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Filtering in PCB Integrated Ultra High Speed Dielectric Wa...
- Publication number 20200112075
- Publication date Apr 9, 2020
- International Business Machines Corporation
- Joshua Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC-BASED WAVEGUIDING IN A MULTI-LAYER PCB
- Publication number 20180115042
- Publication date Apr 26, 2018
- International Business Machines Corporation
- Samuel R. CONNOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CROSSTALK BETWEEN DIELECTRIC WAVEGUIDES USING SPLIT RI...
- Publication number 20180115043
- Publication date Apr 26, 2018
- International Business Machines Corporation
- Daniel M. DREPS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Neural Network Based Prediction of PCB Glass Weave Induced Skew
- Publication number 20180113974
- Publication date Apr 26, 2018
- International Business Machines Corporation
- Dylan J. Boday
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIELECTRIC WAVEGUIDE AND COUPLING MECHANISM IN A PRINTED CIRCUIT BOARD
- Publication number 20180108971
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Samuel R. CONNOR
- H01 - BASIC ELECTRIC ELEMENTS

Junyan TANG

Person

Patents Grantslast 30 patents

Vertically transitioning between substrate integrated waveguides (S...

PCB with substrate integrated waveguides using multi-band monopole...

Embedded filtering in PCB integrated ultra high speed dielectric wa...

Communication system having a multi-layer PCB including a dielectri...

Reduction of crosstalk between dielectric waveguides using split ri...

Multi-layer printed circuit board having first and second coaxial v...

Patents Applicationslast 30 patents

PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION...

DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT

PCB WITH SUBSTRATE INTEGRATED WAVEGUIDES USING MULTI-BAND MONOPOLE...

VERTICALLY TRANSITIONING BETWEEN SUBSTRATE INTEGRATED WAVEGUIDES (S...

Embedded Filtering in PCB Integrated Ultra High Speed Dielectric Wa...

DIELECTRIC-BASED WAVEGUIDING IN A MULTI-LAYER PCB

REDUCTION OF CROSSTALK BETWEEN DIELECTRIC WAVEGUIDES USING SPLIT RI...

Neural Network Based Prediction of PCB Glass Weave Induced Skew

DIELECTRIC WAVEGUIDE AND COUPLING MECHANISM IN A PRINTED CIRCUIT BOARD