Junyeong HEO

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,094,794
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including the same
- Patent number 11,996,367
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,935,832
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having molding layer with inclined side wall
- Patent number 11,869,821
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a first semiconductor stack and a s...
- Patent number 11,721,669
- Issue date Aug 8, 2023
- Samsung Electronics Co, Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including the same
- Patent number 11,694,963
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,515,226
- Issue date Nov 29, 2022
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an insulating material layer with co...
- Patent number 11,469,180
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,424,172
- Issue date Aug 23, 2022
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including the same
- Patent number 11,239,171
- Issue date Feb 1, 2022
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stacked chips and a heat dissipation p...
- Patent number 9,875,992
- Issue date Jan 23, 2018
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250015025
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240379478
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING A...
- Publication number 20240312823
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD
- Publication number 20240203946
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Junyeong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230326863
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230065076
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230034015
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Junyeong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20220399311
- Publication date Dec 15, 2022
- Samsung Electronics Co., Ltd.
- Junyeong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220375808
- Publication date Nov 24, 2022
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220157731
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210375709
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20210343613
- Publication date Nov 4, 2021
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210143102
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210125925
- Publication date Apr 29, 2021
- Samsung Electronics Co., Ltd.
- Junyeong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A FIRST SEMICONDUCTOR STACK AND A S...
- Publication number 20210091045
- Publication date Mar 25, 2021
- Samsung Electronics Co., Ltd.
- JUNYEONG HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF DICING THE SAME
- Publication number 20210050264
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- Donghoon WON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20160079208
- Publication date Mar 17, 2016
- Junyeong HEO
- H01 - BASIC ELECTRIC ELEMENTS

Junyeong HEO

Person

Patents Grantslast 30 patents

Semiconductor package and method of fabricating the same

Semiconductor device and semiconductor package including the same

Semiconductor device and method of fabricating the same

Semiconductor package having molding layer with inclined side wall

Semiconductor package including a first semiconductor stack and a s...

Semiconductor device and semiconductor package including the same

Semiconductor package and method of fabricating the same

Semiconductor device including an insulating material layer with co...

Semiconductor package

Semiconductor device and semiconductor package including the same

Semiconductor package having stacked chips and a heat dissipation p...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING A...

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING A FIRST SEMICONDUCTOR STACK AND A S...

SEMICONDUCTOR SUBSTRATE AND METHOD OF DICING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME