JunYoung Yang

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Paju-Si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,404,358
- Issue date Aug 2, 2022
- ADVANCED SEMICONDUCTOR ENGINEERING KOREA, INC.
- Junyoung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,679,929
- Issue date Jun 9, 2020
- ADVANCED SEMICONDUCTOR ENGINEERING KOREA, INC.
- Junyoung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 7,327,015
- Issue date Feb 5, 2008
- Advanced Semiconductor Engineering, Inc.
- JunYoung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation method used in image sensor packaging process and suppo...
- Patent number 7,186,587
- Issue date Mar 6, 2007
- Advanced Semiconductor Engineering
- JunYoung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and lead frame for making leadless semiconductor packages
- Patent number 7,169,651
- Issue date Jan 30, 2007
- Advanced Semiconductor Engineering, Inc.
- HyungJun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and lead frame for making leadless semiconductor packages
- Patent number 7,087,461
- Issue date Aug 8, 2006
- Advanced Semiconductor Engineering, Inc.
- HyungJun Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200279796
- Publication date Sep 3, 2020
- Advanced Semiconductor Engineering Korea, Inc.
- Junyoung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190035714
- Publication date Jan 31, 2019
- Advanced Semiconductor Engineering Korea, Inc.
- Junyoung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20080150095
- Publication date Jun 26, 2008
- Advanced Semiconductor Engineering, Inc.
- JunYoung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package
- Publication number 20060060953
- Publication date Mar 23, 2006
- JunYoung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process and lead frame for making leadless semiconductor packages
- Publication number 20060035414
- Publication date Feb 16, 2006
- HyungJun Park
- H01 - BASIC ELECTRIC ELEMENTS