Junyun Kweon

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnection structure and semiconductor package including the same
- Patent number 12,347,760
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure and semiconductor device
- Patent number 12,224,256
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and semiconductor package including the same
- Patent number 12,009,288
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including fine redistribution patterns
- Patent number 11,923,309
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 11,854,893
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and semiconductor package including the same
- Patent number 11,798,872
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20250125197
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240387460
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Heejae NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DICING WAFERS HAVING ARRAYS OF SEMICONDUCTOR CHIPS THERE...
- Publication number 20240355678
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240290702
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240203888
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128239
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Solji SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240047296
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240006288
- Publication date Jan 4, 2024
- Junyun Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230420352
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230395547
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230387088
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- YeongBeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20230260845
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCHING APPARATUS AND WAFER ETCHING SYSTEM USING THE SAME
- Publication number 20230104421
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20230096678
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230089399
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Solji SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20230073690
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Hyunsu HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220068779
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220059442
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Dongjoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220037255
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Junyun Kweon

Person

Patents Grantslast 30 patents

Interconnection structure and semiconductor package including the same

Wafer structure and semiconductor device

Interconnection structure and semiconductor package including the same

Semiconductor package including fine redistribution patterns

Method of manufacturing semiconductor package

Interconnection structure and semiconductor package including the same

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHODS OF DICING WAFERS HAVING ARRAYS OF SEMICONDUCTOR CHIPS THERE...

INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

WAFER STRUCTURE AND SEMICONDUCTOR DEVICE

DRY ETCHING APPARATUS AND WAFER ETCHING SYSTEM USING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

WAFER STRUCTURE AND SEMICONDUCTOR DEVICE

INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME