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Junzou Une
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Kawasaki, JP
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last 30 patents
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Patent Grant
Method of encapsulating an electronic component
Patent number
8,065,793
Issue date
Nov 29, 2011
Fujitsu Limited
Kazuyuki Ikura
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
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Patent Application
APPLICATION METHOD AND APPARATUS FOR RESIN
Publication number
20100122457
Publication date
May 20, 2010
Fujitsu Limited
Kazuyuki Ikura
H01 - BASIC ELECTRIC ELEMENTS