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Jurgen Forster
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Tegernheim, DE
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Patents Grants
last 30 patents
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Patent Grant
Multilayer metallization with stress-reducing interlayer
Patent number
8,736,054
Issue date
May 27, 2014
Infineon Technologies AG
Manfred Schneegans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for filling a contact hole and integrated circuit arrangemen...
Patent number
7,825,510
Issue date
Nov 2, 2010
Infineon Technologies AG
Jürgen Förster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for filling a contact hole and integrated circuit arrangemen...
Patent number
7,390,737
Issue date
Jun 24, 2008
Infineon Technologies AG
Jürgen Förster
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Multilayer Metallization with Stress-Reducing Interlayer
Publication number
20130026633
Publication date
Jan 31, 2013
INFINEON TECHNOLOGIES AG
Manfred Schneegans
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FILLING A CONTACT HOLE AND INTEGRATED CIRCUIT ARRANGEMEN...
Publication number
20080136032
Publication date
Jun 12, 2008
Infineon Technologies AG
Jurgen Forster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for filling a contact hole and integrated circuit arrangemen...
Publication number
20060024946
Publication date
Feb 2, 2006
Jurgen Forster
H01 - BASIC ELECTRIC ELEMENTS