Jurgen Forster

Follow

Person

Tegernheim, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer metallization with stress-reducing interlayer
- Patent number 8,736,054
- Issue date May 27, 2014
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling a contact hole and integrated circuit arrangemen...
- Patent number 7,825,510
- Issue date Nov 2, 2010
- Infineon Technologies AG
- Jürgen Förster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling a contact hole and integrated circuit arrangemen...
- Patent number 7,390,737
- Issue date Jun 24, 2008
- Infineon Technologies AG
- Jürgen Förster
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INDUCING MECHANICAL STRESS IN MAGNETORESISTIVE SENSING ELEMENT TO A...
- Publication number 20240329166
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Bernhard ENDRES
- G01 - MEASURING TESTING
Information Patent Application
Multilayer Metallization with Stress-Reducing Interlayer
- Publication number 20130026633
- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FILLING A CONTACT HOLE AND INTEGRATED CIRCUIT ARRANGEMEN...
- Publication number 20080136032
- Publication date Jun 12, 2008
- Infineon Technologies AG
- Jurgen Forster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for filling a contact hole and integrated circuit arrangemen...
- Publication number 20060024946
- Publication date Feb 2, 2006
- Jurgen Forster
- H01 - BASIC ELECTRIC ELEMENTS