Justin B. Dorhout

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated structures comprising vertical channel material and havi...
- Patent number 12,029,039
- Issue date Jul 2, 2024
- Guangyu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,029,032
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies which include stacked memory decks, and metho...
- Patent number 12,010,850
- Issue date Jun 11, 2024
- John D. Hopkins
Information Patent Grant
Microelectronic devices with slit structures including metal plugs...
- Patent number 11,985,823
- Issue date May 14, 2024
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures including material containing silicon, nitrog...
- Patent number 11,937,429
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including support pillar structures, and re...
- Patent number 11,910,598
- Issue date Feb 20, 2024
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Grant
Device, a method used in forming a circuit structure, a method used...
- Patent number 11,889,695
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,864,387
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having conductive posts extending through sta...
- Patent number 11,800,706
- Issue date Oct 24, 2023
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,792,991
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies which include stacked memory decks
- Patent number 11,744,072
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- John D. Hopkins
Information Patent Grant
Methods of forming electronic devices with channel openings or pill...
- Patent number 11,706,925
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- John D. Hopkins
Information Patent Grant
Memory arrays and methods used in forming a memory array and conduc...
- Patent number 11,705,385
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Indra V. Chary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related memory devi...
- Patent number 11,696,445
- Issue date Jul 4, 2023
- Micron Technology, Inc.
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,631,684
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures comprising vertical channel material and havi...
- Patent number 11,569,266
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Guangyu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,563,022
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices and systems with channel openings or pillars ext...
- Patent number 11,495,617
- Issue date Nov 8, 2022
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including stair step structures, and relate...
- Patent number 11,417,673
- Issue date Aug 16, 2022
- Micron Technology, Inc.
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having anchoring structures proximate stacked...
- Patent number 11,348,933
- Issue date May 31, 2022
- Micron Technology, Inc.
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 11,329,062
- Issue date May 10, 2022
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,309,328
- Issue date Apr 19, 2022
- Micron Technology, Inc.
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,244,955
- Issue date Feb 8, 2022
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures including material containing silicon, nitrog...
- Patent number 11,239,252
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, a method used in forming a circuit structure, a method used...
- Patent number 11,177,271
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having conductive posts extending through sta...
- Patent number 11,121,143
- Issue date Sep 14, 2021
- Micron Technology, Inc.
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming integrated assemblies include stacked memory decks
- Patent number 11,107,831
- Issue date Aug 31, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods used in forming a memory array comprising strings of memory...
- Patent number 11,094,627
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Vladimir Machkaoutsan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures
- Patent number 11,081,495
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array and conduc...
- Patent number 11,069,598
- Issue date Jul 20, 2021
- Micron Technology, Inc.
- Indra V. Chary
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Structures Comprising Vertical Channel Material and Havi...
- Publication number 20240357819
- Publication date Oct 24, 2024
- Lodestar Licensing Group LLC
- Guangyu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAYS COMPRISING OPERATIVE CHANNEL-MATERIAL STRINGS AND DUM...
- Publication number 20240321727
- Publication date Sep 26, 2024
- Lodestar Licensing Group LLC
- Vladimir Machkaoutsan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240315018
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC...
- Publication number 20240292623
- Publication date Aug 29, 2024
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Conductive Posts Extending Through Sta...
- Publication number 20240237336
- Publication date Jul 11, 2024
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING SUPPORT PILLARS
- Publication number 20240188288
- Publication date Jun 6, 2024
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies Having Conductive Posts Extending Through Sta...
- Publication number 20240138146
- Publication date Apr 25, 2024
- Lodestar Licensing Group LLC
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Arrays and Methods Used in Forming a Memory Array Comprising...
- Publication number 20240081067
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20240008275
- Publication date Jan 4, 2024
- Lodestar Licensing Group LLC
- John D. Hopkins
Information Patent Application
MICOELECTRONIC DEVICES WITH PILLARS OR OPENINGS EXTENDING THROUGH A...
- Publication number 20230363168
- Publication date Nov 9, 2023
- Lodestar Licensing Group, LLC
- John D. Hopkins
Information Patent Application
MICROELECTRONIC DEVICES AND RELATED MEMORY DEVICES
- Publication number 20230363164
- Publication date Nov 9, 2023
- Lodestar Licensing Group, LLC
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230209822
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures Comprising Vertical Channel Material and Havi...
- Publication number 20230171962
- Publication date Jun 1, 2023
- Micron Technology, Inc.
- Guangyu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays and Methods Used in Forming a Memory Array Comprising...
- Publication number 20230143406
- Publication date May 11, 2023
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ELECTRONIC DEVICES WITH CHANNEL OPENINGS OR PILL...
- Publication number 20230092501
- Publication date Mar 23, 2023
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATE...
- Publication number 20230063178
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Bo Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING SUPPORT PILLAR STRUCTURES, AND RE...
- Publication number 20220367500
- Publication date Nov 17, 2022
- Micron Technology, Inc.
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVI...
- Publication number 20220181352
- Publication date Jun 9, 2022
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20220130857
- Publication date Apr 28, 2022
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures Including Material Containing Silicon, Nitrog...
- Publication number 20220115401
- Publication date Apr 14, 2022
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH SLIT STRUCTURES INLCUDING METAL PLUGS...
- Publication number 20220109001
- Publication date Apr 7, 2022
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device, a Method Used in Forming a Circuit Structure, a Method Used...
- Publication number 20220037360
- Publication date Feb 3, 2022
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATE...
- Publication number 20210398997
- Publication date Dec 23, 2021
- Micron Technology, Inc.
- Shuangqiang Luo
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies Having Conductive Posts Extending Through Sta...
- Publication number 20210375894
- Publication date Dec 2, 2021
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20210358951
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures
- Publication number 20210343743
- Publication date Nov 4, 2021
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array And Conduc...
- Publication number 20210343624
- Publication date Nov 4, 2021
- Micron Technology, Inc.
- Indra V. Chary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Operative Channel-Material Strings And Dum...
- Publication number 20210343640
- Publication date Nov 4, 2021
- Micron Technology, Inc.
- Vladimir Machkaoutsan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures Comprising Vertical Channel Material and Havi...
- Publication number 20210257387
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Guangyu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20210233922
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS

Justin B. Dorhout

Person

Patents Grantslast 30 patents

Integrated structures comprising vertical channel material and havi...

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies which include stacked memory decks, and metho...

Microelectronic devices with slit structures including metal plugs...

Integrated structures including material containing silicon, nitrog...

Microelectronic devices including support pillar structures, and re...

Device, a method used in forming a circuit structure, a method used...

Memory arrays and methods used in forming a memory array comprising...

Integrated assemblies having conductive posts extending through sta...

Memory arrays and methods used in forming a memory array comprising...

Integrated assemblies which include stacked memory decks

Methods of forming electronic devices with channel openings or pill...

Memory arrays and methods used in forming a memory array and conduc...

Methods of forming microelectronic devices, and related memory devi...

Integrated assemblies and methods of forming integrated assemblies

Integrated structures comprising vertical channel material and havi...

Memory arrays and methods used in forming a memory array comprising...

Electronic devices and systems with channel openings or pillars ext...

Microelectronic devices including stair step structures, and relate...

Integrated assemblies having anchoring structures proximate stacked...

Memory arrays and methods used in forming a memory array

Methods of forming microelectronic devices, and related microelectr...

Memory arrays and methods used in forming a memory array comprising...

Integrated structures including material containing silicon, nitrog...

Device, a method used in forming a circuit structure, a method used...

Integrated assemblies having conductive posts extending through sta...

Methods of forming integrated assemblies include stacked memory decks

Methods used in forming a memory array comprising strings of memory...

Integrated structures

Memory arrays and methods used in forming a memory array and conduc...

Patents Applicationslast 30 patents

Integrated Structures Comprising Vertical Channel Material and Havi...

MEMORY ARRAYS COMPRISING OPERATIVE CHANNEL-MATERIAL STRINGS AND DUM...

Integrated Assemblies and Methods of Forming Integrated Assemblies

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED ELECTRONIC...

Integrated Assemblies Having Conductive Posts Extending Through Sta...

MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING SUPPORT PILLARS

Integrated Assemblies Having Conductive Posts Extending Through Sta...

Memory Arrays and Methods Used in Forming a Memory Array Comprising...

Integrated Assemblies Which Include Stacked Memory Decks, and Metho...

MICOELECTRONIC DEVICES WITH PILLARS OR OPENINGS EXTENDING THROUGH A...

MICROELECTRONIC DEVICES AND RELATED MEMORY DEVICES

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Structures Comprising Vertical Channel Material and Havi...

Memory Arrays and Methods Used in Forming a Memory Array Comprising...

METHODS OF FORMING ELECTRONIC DEVICES WITH CHANNEL OPENINGS OR PILL...

MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATE...

MICROELECTRONIC DEVICES INCLUDING SUPPORT PILLAR STRUCTURES, AND RE...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVI...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Integrated Structures Including Material Containing Silicon, Nitrog...

MICROELECTRONIC DEVICES WITH SLIT STRUCTURES INLCUDING METAL PLUGS...

Device, a Method Used in Forming a Circuit Structure, a Method Used...

MICROELECTRONIC DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATE...

Integrated Assemblies Having Conductive Posts Extending Through Sta...

Integrated Assemblies Which Include Stacked Memory Decks, and Metho...

Integrated Structures

Memory Arrays And Methods Used In Forming A Memory Array And Conduc...

Memory Arrays Comprising Operative Channel-Material Strings And Dum...

Integrated Structures Comprising Vertical Channel Material and Havi...

Integrated Assemblies and Methods of Forming Integrated Assemblies