Justin E. POARCH

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,861,764
- Issue date Dec 8, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,269,678
- Issue date Apr 23, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 9,455,216
- Issue date Sep 27, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. Daniels
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 9,093,436
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. Daniels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 8,841,758
- Issue date Sep 23, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. Daniels
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device package having backside contact and method for...
- Patent number 8,685,790
- Issue date Apr 1, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methodology for processing a panel during semiconductor device fabr...
- Patent number 7,892,950
- Issue date Feb 22, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device assembly with integrated coil and method of forming...
- Patent number 7,868,729
- Issue date Jan 11, 2011
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multi-chips semiconductor device assemblies and methods for fabrica...
- Patent number 7,339,275
- Issue date Mar 4, 2008
- FREESCALE SEMICONDUCTOR, INC.
- James Jen Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly and method for forming
- Patent number 7,132,303
- Issue date Nov 7, 2006
- FREESCALE SEMICONDUCTOR, INC.
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...
- Publication number 20190206759
- Publication date Jul 4, 2019
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20150228560
- Publication date Aug 13, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. DANIELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20140338956
- Publication date Nov 20, 2014
- Dwight L. DANIELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING BACKSIDE CONTACT AND METHOD FOR...
- Publication number 20140167247
- Publication date Jun 19, 2014
- FREESCALE SEMICONDUCTOR IN.
- ALAN J. MAGNUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20140001616
- Publication date Jan 2, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Dwight L. DANIELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING BACKSIDE CONTACT AND METHOD FOR...
- Publication number 20130207255
- Publication date Aug 15, 2013
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODOLOGY FOR PROCESSING A PANEL DURING SEMICONDUCTOR DEVICE FABR...
- Publication number 20100279467
- Publication date Nov 4, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE ASSEMBLY WITH INTEGRATED COIL AND METHOD OF FORMING...
- Publication number 20100225434
- Publication date Sep 9, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chips semiconductor device assemblies and methods for fabrica...
- Publication number 20060108697
- Publication date May 25, 2006
- James Jen Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor device assembly and method for forming
- Publication number 20050136558
- Publication date Jun 23, 2005
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS

Justin E. POARCH

Person

Patents Grantslast 30 patents

Microelectronic components having integrated heat dissipation posts...

Microelectronic components having integrated heat dissipation posts...

Semiconductor device package and method of manufacture

Semiconductor device package and method of manufacture

Semiconductor device package and method of manufacture

Semiconductor device package having backside contact and method for...

Methodology for processing a panel during semiconductor device fabr...

Stacked device assembly with integrated coil and method of forming...

Multi-chips semiconductor device assemblies and methods for fabrica...

Stacked semiconductor device assembly and method for forming

Patents Applicationslast 30 patents

MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE PACKAGE HAVING BACKSIDE CONTACT AND METHOD FOR...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE PACKAGE HAVING BACKSIDE CONTACT AND METHOD FOR...

METHODOLOGY FOR PROCESSING A PANEL DURING SEMICONDUCTOR DEVICE FABR...

STACKED DEVICE ASSEMBLY WITH INTEGRATED COIL AND METHOD OF FORMING...

Multi-chips semiconductor device assemblies and methods for fabrica...

Stacked semiconductor device assembly and method for forming