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Justin Ho Kuen Wong
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Pleasanton, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Polishing carrier head with piezoelectric pressure control
Patent number
12,030,156
Issue date
Jul 9, 2024
Applied Materials, Inc.
Brian J. Brown
B24 - GRINDING POLISHING
Information
Patent Grant
Polishing carrier head with piezoelectric pressure control
Patent number
11,890,715
Issue date
Feb 6, 2024
Applied Materials, Inc.
Brian J. Brown
B24 - GRINDING POLISHING
Information
Patent Grant
Wafer processing tools and methods thereof
Patent number
11,749,552
Issue date
Sep 5, 2023
Applied Materials, Inc.
Jagan Rangarajan
B24 - GRINDING POLISHING
Information
Patent Grant
Substrate polish edge uniformity control with secondary fluid dispense
Patent number
11,724,355
Issue date
Aug 15, 2023
Applied Materials, Inc.
Justin H. Wong
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
WAFER PROCESSING TOOLS AND METHODS THEREOF
Publication number
20230352337
Publication date
Nov 2, 2023
Applied Materials, Inc.
Jagan Rangarajan
B24 - GRINDING POLISHING
Information
Patent Application
SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE
Publication number
20230339066
Publication date
Oct 26, 2023
Applied Materials, Inc.
Justin H. WONG
B24 - GRINDING POLISHING
Information
Patent Application
DISPLACEMENT MEASUREMENTS IN SEMICONDUCTOR WAFER PROCESSING
Publication number
20220384221
Publication date
Dec 1, 2022
Applied Materials, Inc.
Justin H. Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLACEMENT MEASUREMENTS IN SEMICONDUCTOR WAFER PROCESSING
Publication number
20220384278
Publication date
Dec 1, 2022
Applied Materials, Inc.
Justin Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DRYING SYSTEM WITH INTEGRATED SUBSTRATE ALIGNMENT STAGE
Publication number
20220285175
Publication date
Sep 8, 2022
Applied Materials, Inc.
Justin Ho Kuen Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE
Publication number
20220097198
Publication date
Mar 31, 2022
Applied Materials, Inc.
Justin H. WONG
B24 - GRINDING POLISHING
Information
Patent Application
POLISHING CARRIER HEAD WITH PIEZOELECTRIC PRESSURE CONTROL
Publication number
20210402546
Publication date
Dec 30, 2021
Applied Materials, Inc.
Brian J. Brown
B24 - GRINDING POLISHING
Information
Patent Application
POLISHING CARRIER HEAD WITH PIEZOELECTRIC PRESSURE CONTROL
Publication number
20210402547
Publication date
Dec 30, 2021
Applied Materials, Inc.
Brian J. Brown
B24 - GRINDING POLISHING
Information
Patent Application
Wafer Processing Tools and Methods Thereof
Publication number
20200234995
Publication date
Jul 23, 2020
Jagan Rangarajan
H01 - BASIC ELECTRIC ELEMENTS