Justin Huang

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Rework process and tool design for semiconductor package
- Patent number 10,269,762
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for spur estimation and mitigation
- Patent number 8,451,918
- Issue date May 28, 2013
- QUALCOMM Incorporated
- Hao-Ren Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
System and method for frequency offset and symbol index estimation
- Patent number 8,340,221
- Issue date Dec 25, 2012
- QUALCOMM Incorporated
- Hao-ren Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pad backer and CMP process using the same
- Patent number 7,048,615
- Issue date May 23, 2006
- United Microelectronics Corp.
- Li-Min Chang
- B24 - GRINDING POLISHING
Information Patent Grant
Pad backer
- Patent number 6,921,324
- Issue date Jul 26, 2005
- United Microelectronics Corp.
- Li-Min Chang
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Rework Process and Tool Design for Semiconductor Package
- Publication number 20170125374
- Publication date May 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PAD BACKER AND CMP PROCESS USING THE SAME
- Publication number 20060030241
- Publication date Feb 9, 2006
- Li-Min Chang
- B24 - GRINDING POLISHING