Justin Scott Kayser

Person

Wentzville, MO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cleave systems having spring members for cleaving a semiconductor s...
- Patent number 12,148,635
- Issue date Nov 19, 2024
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaved semiconductor wafer imaging system
- Patent number 12,019,031
- Issue date Jun 25, 2024
- GlobalWafers Co., Ltd.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cleaved semiconductor wafer camera system
- Patent number 11,921,054
- Issue date Mar 5, 2024
- GlobalWafers Co., Ltd.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cleave systems having spring members for cleaving a semiconductor s...
- Patent number 11,538,698
- Issue date Dec 27, 2022
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for separating bonded wafer structures
- Patent number 10,910,280
- Issue date Feb 2, 2021
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- B32 - LAYERED PRODUCTS
Information Patent Grant
Cleave systems, mountable cleave monitoring systems, and methods fo...
- Patent number 10,679,908
- Issue date Jun 9, 2020
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
CLEAVE SYSTEMS HAVING SPRING MEMBERS FOR CLEAVING A SEMICONDUCTOR S...
- Publication number 20240332042
- Publication date Oct 3, 2024
- GLOBALWAFERS CO., LTD.
- Justin Scott Kayser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEAVE SYSTEMS HAVING SPRING MEMBERS FOR CLEAVING A SEMICONDUCTOR S...
- Publication number 20230031395
- Publication date Feb 2, 2023
- GLOBALWAFERS CO., LTD.
- Justin Scott Kayser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEAVED SEMICONDUCTOR WAFER IMAGING SYSTEM
- Publication number 20220084857
- Publication date Mar 17, 2022
- GLOBALWAFERS CO., LTD.
- Benjamin Michael Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEAVED SEMICONDUCTOR WAFER CAMERA SYSTEM
- Publication number 20220082510
- Publication date Mar 17, 2022
- GLOBALWAFERS CO., LTD.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF PROCESSING A CLEAVED SEMICONDUCTOR WAFER
- Publication number 20220084892
- Publication date Mar 17, 2022
- GLOBALWAFERS CO., LTD.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Device and Method for Pollen Collection
- Publication number 20210337736
- Publication date Nov 4, 2021
- Monsanto Technology LLC
- Zachary Boyer
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
CLEAVE SYSTEMS HAVING SPRING MEMBERS FOR CLEAVING A SEMICONDUCTOR S...
- Publication number 20210098272
- Publication date Apr 1, 2021
- GlobaWafers Co., Ltd.
- Justin Scott Kayser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SEPARATING BONDED WAFER STRUCTURES
- Publication number 20190206745
- Publication date Jul 4, 2019
- GLOBALWAFERS CO., LTD.
- Justin Scott Kayser
- B32 - LAYERED PRODUCTS
Information Patent Application
CLEAVE SYSTEMS, MOUNTABLE CLEAVE MONITORING SYSTEMS, AND METHODS FO...
- Publication number 20180211889
- Publication date Jul 26, 2018
- SunEdison Semiconductor Limited (UEN201334164H)
- Justin Scott Kayser
- H01 - BASIC ELECTRIC ELEMENTS

Justin Scott Kayser

Person

Patents Grantslast 30 patents

Cleave systems having spring members for cleaving a semiconductor s...

Cleaved semiconductor wafer imaging system

Cleaved semiconductor wafer camera system

Cleave systems having spring members for cleaving a semiconductor s...

Methods for separating bonded wafer structures

Cleave systems, mountable cleave monitoring systems, and methods fo...

Patents Applicationslast 30 patents

CLEAVE SYSTEMS HAVING SPRING MEMBERS FOR CLEAVING A SEMICONDUCTOR S...

CLEAVE SYSTEMS HAVING SPRING MEMBERS FOR CLEAVING A SEMICONDUCTOR S...

CLEAVED SEMICONDUCTOR WAFER IMAGING SYSTEM

CLEAVED SEMICONDUCTOR WAFER CAMERA SYSTEM

METHOD OF PROCESSING A CLEAVED SEMICONDUCTOR WAFER

Device and Method for Pollen Collection

CLEAVE SYSTEMS HAVING SPRING MEMBERS FOR CLEAVING A SEMICONDUCTOR S...

METHODS FOR SEPARATING BONDED WAFER STRUCTURES

CLEAVE SYSTEMS, MOUNTABLE CLEAVE MONITORING SYSTEMS, AND METHODS FO...