Jyh Chwen Frank Lee

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation in semiconductor packages and methods of forming same
- Patent number 12,074,148
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 11,967,591
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of power-grounds in package structures
- Patent number 11,929,340
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapsulant comprising conductive f...
- Patent number 11,842,946
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 11,817,324
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation in semiconductor packages and methods of forming same
- Patent number 11,527,518
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heat Dissipation in Semiconductor Packages and Methods of Forming Same
- Publication number 20240371839
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
- Publication number 20240213237
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement of Power-Grounds in Package Structures
- Publication number 20240178177
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20240071865
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Info Packages Including Thermal Dissipation Blocks
- Publication number 20240021441
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE DEVICE HAVING OPPOS...
- Publication number 20230387078
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY-AWARE SEMICONDUCTOR PACKAGES
- Publication number 20230223379
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF ESTIMATING THERMAL PROPERTIES OF SEMICONDUCT...
- Publication number 20230117009
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yi Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Heat Dissipation in Semiconductor Packages and Methods of Forming Same
- Publication number 20230109128
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
- Publication number 20230037331
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Info Packages Including Thermal Dissipation Blocks
- Publication number 20220367210
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacture
- Publication number 20220310480
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT OF POWER-GROUNDS IN PACKAGE STRUCTURES
- Publication number 20220230981
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD TH...
- Publication number 20220149020
- Publication date May 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20220028842
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Jyh Chwen Frank Lee

Person

Patents Grantslast 30 patents

Heat dissipation in semiconductor packages and methods of forming same

Info packages including thermal dissipation blocks

Arrangement of power-grounds in package structures

Semiconductor package having an encapsulant comprising conductive f...

Info packages including thermal dissipation blocks

Heat dissipation in semiconductor packages and methods of forming same

Patents Applicationslast 30 patents

Heat Dissipation in Semiconductor Packages and Methods of Forming Same

INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS

Arrangement of Power-Grounds in Package Structures

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

Info Packages Including Thermal Dissipation Blocks

SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE DEVICE HAVING OPPOS...

THERMALLY-AWARE SEMICONDUCTOR PACKAGES

SYSTEMS AND METHODS OF ESTIMATING THERMAL PROPERTIES OF SEMICONDUCT...

Heat Dissipation in Semiconductor Packages and Methods of Forming Same

INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS

Info Packages Including Thermal Dissipation Blocks

Semiconductor Package and Method of Manufacture

ARRANGEMENT OF POWER-GROUNDS IN PACKAGE STRUCTURES

PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD TH...

HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME