Jyh-Rong Sheu

Person

Hsin Chu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Temperature controllable bonder equipment for substrate bonding
- Patent number 12,368,129
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a uniform and thin silicide layer on an...
- Patent number 12,362,187
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser de-bonding carriers and composite carriers thereof
- Patent number 12,347,696
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation with annealing for substrate cutting
- Patent number 12,327,811
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding system and method of using the same
- Patent number 12,255,171
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic bonding gap control and tool for wafer bonding
- Patent number 12,249,592
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system with sealing gasket and method for using the same
- Patent number 12,237,211
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacture by monitoring relative...
- Patent number 12,230,532
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding apparatus and method
- Patent number 12,211,820
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-I Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding
- Patent number 12,165,888
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation for semiconductor devices and methods of manufacture
- Patent number 11,990,404
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal adhesion layer to promote metal plug adhesion
- Patent number 11,955,379
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser de-bonding carriers and composite carriers thereof
- Patent number 11,908,708
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,894,438
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yee-Chia Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation with annealing for substrate cutting
- Patent number 11,855,040
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming STI regions to separate semiconductor Fins
- Patent number 11,450,661
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,043,570
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yee-Chia Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact plug and method manufacturing same
- Patent number 10,879,075
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a uniform and thin silicide layer on an...
- Patent number 10,811,262
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of interconnection structure of semiconductor device
- Patent number 10,658,234
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Hsiu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact plug and method manufacturing same
- Patent number 10,636,664
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,593,775
- Issue date Mar 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yee-Chia Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,546,938
- Issue date Jan 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yee-Chia Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact plug and method manufacturing same
- Patent number 10,475,654
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact plug and method manufacturing same
- Patent number 10,468,260
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor Fin FET device with epitaxial source/drain
- Patent number 10,312,369
- Issue date Jun 4, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Li Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,164,042
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yee-Chia Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming STI regions in integrated circuits
- Patent number 9,953,975
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal liner overhang reduction and manufacturing method thereof
- Patent number 9,899,258
- Issue date Feb 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor Fin FET device with epitaxial source/drain
- Patent number 9,859,427
- Issue date Jan 2, 2018
- Tawain Semiconductor Manufacturing Co., Ltd.
- Hung-Li Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING SYSTEM WITH SEALING GASKET AND METHOD FOR USING THE SAME
- Publication number 20250191968
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method of Manufacture by Monitoring Relative...
- Publication number 20250149378
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Apparatus and Method
- Publication number 20240387451
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-I Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD FOR USING THE SAME
- Publication number 20240387232
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING SYSTEM AND METHOD OF USING THE SAME
- Publication number 20240387445
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING
- Publication number 20240379616
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240282761
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240266285
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION
- Publication number 20240249977
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DE-BONDING CARRIERS AND COMPOSITE CARRIERS THEREOF
- Publication number 20240153786
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145569
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yee-Chia YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING
- Publication number 20240120314
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method of Manufacture, and System of Manufacture
- Publication number 20230063975
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE CONTROLLABLE BONDER EQUIPMENT FOR SUBSTRATE BONDING
- Publication number 20230067088
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER BONDING SYSTEM AND METHOD OF USING THE SAME
- Publication number 20230067346
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dynamic Bonding Gap Control and Tool for Wafer Bonding
- Publication number 20230019415
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Apparatus and Method
- Publication number 20230010038
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-I Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser De-Bonding Carriers and Composite Carriers Thereof
- Publication number 20220406621
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ion Implantation with Annealing for Substrate Cutting
- Publication number 20220367410
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD FOR USING THE SAME
- Publication number 20220367249
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR BONDING
- Publication number 20220367215
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation for Semiconductor Devices and Methods of Manufacture
- Publication number 20220359369
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD FOR USING THE SAME
- Publication number 20220344197
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION
- Publication number 20220084879
- Publication date Mar 17, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Pei-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210313438
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yee-Chia YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A UNIFORM AND THIN SILICIDE LAYER ON AN...
- Publication number 20210035806
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Hsuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wrap-Around Contact Plug and Method Manufacturing Same
- Publication number 20200258746
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200212191
- Publication date Jul 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yee-Chia YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wrap-Around Contact Plug and Method Manufacturing Same
- Publication number 20200043738
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190123161
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yee-Chia YEO
- H01 - BASIC ELECTRIC ELEMENTS

Jyh-Rong Sheu

Person

Patents Grantslast 30 patents

Temperature controllable bonder equipment for substrate bonding

Semiconductor device having a uniform and thin silicide layer on an...

Laser de-bonding carriers and composite carriers thereof

Ion implantation with annealing for substrate cutting

Wafer bonding system and method of using the same

Dynamic bonding gap control and tool for wafer bonding

Bonding system with sealing gasket and method for using the same

Semiconductor device, method of manufacture by monitoring relative...

Wafer bonding apparatus and method

Method and system for bonding

Heat dissipation for semiconductor devices and methods of manufacture

Metal adhesion layer to promote metal plug adhesion

Laser de-bonding carriers and composite carriers thereof

Semiconductor device and manufacturing method thereof

Ion implantation with annealing for substrate cutting

Forming STI regions to separate semiconductor Fins

Semiconductor device and manufacturing method thereof

Wrap-around contact plug and method manufacturing same

Semiconductor device having a uniform and thin silicide layer on an...

Formation method of interconnection structure of semiconductor device

Wrap-around contact plug and method manufacturing same

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Wrap-around contact plug and method manufacturing same

Wrap-around contact plug and method manufacturing same

Semiconductor Fin FET device with epitaxial source/drain

Semiconductor device and manufacturing method thereof

Methods for forming STI regions in integrated circuits

Metal liner overhang reduction and manufacturing method thereof

Semiconductor Fin FET device with epitaxial source/drain

Patents Applicationslast 30 patents

BONDING SYSTEM WITH SEALING GASKET AND METHOD FOR USING THE SAME

Semiconductor Device, Method of Manufacture by Monitoring Relative...

Wafer Bonding Apparatus and Method

BONDING SYSTEM AND METHOD FOR USING THE SAME

WAFER BONDING SYSTEM AND METHOD OF USING THE SAME

DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING

CARRIER STRUCTURE AND METHODS OF FORMING THE SAME

HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION

LASER DE-BONDING CARRIERS AND COMPOSITE CARRIERS THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING

Semiconductor Device, Method of Manufacture, and System of Manufacture

TEMPERATURE CONTROLLABLE BONDER EQUIPMENT FOR SUBSTRATE BONDING

WAFER BONDING SYSTEM AND METHOD OF USING THE SAME

Dynamic Bonding Gap Control and Tool for Wafer Bonding

Wafer Bonding Apparatus and Method

Laser De-Bonding Carriers and Composite Carriers Thereof

Ion Implantation with Annealing for Substrate Cutting

BONDING SYSTEM AND METHOD FOR USING THE SAME

METHOD AND SYSTEM FOR BONDING

Heat Dissipation for Semiconductor Devices and Methods of Manufacture

BONDING SYSTEM AND METHOD FOR USING THE SAME

METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING A UNIFORM AND THIN SILICIDE LAYER ON AN...

Wrap-Around Contact Plug and Method Manufacturing Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Wrap-Around Contact Plug and Method Manufacturing Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF