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Jyishyang Liu

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  • Shanghai, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor die and die cutting method
    • Patent number 9,613,865
    • Issue date Apr 4, 2017
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Jyishyang Liu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DIE AND DIE CUTTING METHOD
    • Publication number 20160204071
    • Publication date Jul 14, 2016
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Jyishyang Liu
    • H01 - BASIC ELECTRIC ELEMENTS