Jyun-De Wu

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive capping for work function layer and method forming same
- Patent number 12,119,386
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed contacts at line end and methods forming same
- Patent number 12,107,007
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of gate contact opening
- Patent number 12,107,003
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light emitting diode chip
- Patent number 12,095,003
- Issue date Sep 17, 2024
- PlayNitride Display Co., Ltd.
- Hsin-Chiao Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,080,597
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer-on-substrate package with improved yield
- Patent number 12,068,300
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of gate contact opening
- Patent number 12,057,345
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,996,321
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter block for recessed contacts and methods forming same
- Patent number 11,967,622
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and manufacturing method thereof
- Patent number 11,967,526
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts for semiconductor devices and methods of forming the same
- Patent number 11,961,893
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode
- Patent number 11,949,043
- Issue date Apr 2, 2024
- PLAYNITRIDE DISPLAY CO., LTD.
- Yen-Chun Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of via opening
- Patent number 11,942,371
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with conductive via structure and me...
- Patent number 11,810,919
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jyun-De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting device
- Patent number 11,769,857
- Issue date Sep 26, 2023
- PlayNitride Display Co., Ltd.
- Yen-Chun Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of via opening
- Patent number 11,749,732
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of gate contact opening
- Patent number 11,705,491
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of gate contact opening
- Patent number 11,664,272
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting semiconductor structure and light-emitting semicondu...
- Patent number 11,658,268
- Issue date May 23, 2023
- PlayNitride Display Co., Ltd.
- Hsin-Chiao Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control of gate contact opening
- Patent number 11,581,218
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafter, wafer testing system, and method thereof
- Patent number 11,567,124
- Issue date Jan 31, 2023
- PlayNitride Display Co., Ltd.
- Jyun-De Wu
- G01 - MEASURING TESTING
Information Patent Grant
Heating apparatus and chemical vapor deposition system
- Patent number 11,542,604
- Issue date Jan 3, 2023
- PlayNitride Display Co., Ltd.
- Jyun-De Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Micro semiconductor device
- Patent number 11,411,141
- Issue date Aug 9, 2022
- PlayNitride Display Co., Ltd.
- Yen-Chun Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal shielding layer in backside illumination image sensor chips a...
- Patent number 11,018,176
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electroplating metal into recessed feature and electropla...
- Patent number 10,879,629
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor structure and manufacturing method for the same
- Patent number 10,847,492
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jyun-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electroplating metal into recessed feature and electropla...
- Patent number 10,749,278
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Light emitting device
- Patent number 10,431,710
- Issue date Oct 1, 2019
- PlayNitride Inc.
- Jyun-De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned substrate and light emitting diode wafer
- Patent number 10,411,159
- Issue date Sep 10, 2019
- PlayNitride Inc.
- Yen-Lin Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor structure and semiconductor light emitting de...
- Patent number 10,381,511
- Issue date Aug 13, 2019
- Genesis Photonics Inc.
- Yen-Lin Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-ON-WAFER-ON-SUBSTRATE PACKAGE WITH IMPROVED YIELD
- Publication number 20240355804
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH CONTROLLED GATE CONTACT PROFILE
- Publication number 20240332063
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240312833
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTS FOR SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20240250143
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER BLOCK FOR RECESSED CONTACTS AND METHODS FORMING SAME
- Publication number 20240234527
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURES TO DETERMINE INTEGRATED CIRCUIT BONDING ENERGIES AN...
- Publication number 20240094104
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE
- Publication number 20240079409
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jyun-De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
- Publication number 20240071974
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bridge Die Having Different Surface Orientation Than Ic Dies Interc...
- Publication number 20240055354
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF VIA OPENING
- Publication number 20240030070
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER INCLUDING STEPPED SURFACES AND METHODS OF FORMING THE SAME
- Publication number 20240030076
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20230422403
- Publication date Dec 28, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS WITH INTEGRATED SLURRY MIXE...
- Publication number 20230373062
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chen Wei
- B24 - GRINDING POLISHING
Information Patent Application
ETCH PROFILE CONTROL OF VIA OPENING
- Publication number 20230361185
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING APPARATUS AND CHEMICAL VAPOR DEPOSITION SYSTEM
- Publication number 20230340669
- Publication date Oct 26, 2023
- PlayNitride Display Co., Ltd.
- Jyun-De Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335435
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF GATE CONTACT OPENING
- Publication number 20230326978
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT-EMITTING DIODE
- Publication number 20230299059
- Publication date Sep 21, 2023
- PlayNitride Display Co., Ltd.
- Chi-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF GATE CONTACT OPENING
- Publication number 20230298934
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEGMENTATION METHOD FOR LIPID DROPLET IN PATHOLOGICAL SLICE IMAGE
- Publication number 20230289975
- Publication date Sep 14, 2023
- National Cheng Kung University
- Pau-Choo CHUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP-ON-WAFER-ON-SUBSTRATE PACKAGE WITH IMPROVED YIELD
- Publication number 20230275077
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Forming Gate Stacks Adopting Thin Silicon Cap
- Publication number 20230238241
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF GATE CONTACT OPENING
- Publication number 20230187270
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor Gate Structures and Methods of Forming the Same
- Publication number 20230163129
- Publication date May 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsueh-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20230047598
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT EMITTING DIODE CHIP
- Publication number 20230008639
- Publication date Jan 12, 2023
- PlayNitride Display Co., Ltd.
- Hsin-Chiao Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220406653
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND ME...
- Publication number 20220406777
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jyun-De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER BLOCK FOR RECESSED CONTACTS AND METHODS FORMING SAME
- Publication number 20220359684
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME
- Publication number 20220359287
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Conductive capping for work function layer and method forming same

Recessed contacts at line end and methods forming same

Etch profile control of gate contact opening

Micro light emitting diode chip

Semiconductor devices and methods of manufacture

Chip-on-wafer-on-substrate package with improved yield

Etch profile control of gate contact opening

Semiconductor structure and method for forming the same

Inter block for recessed contacts and methods forming same

Integrated circuit structure and manufacturing method thereof

Contacts for semiconductor devices and methods of forming the same

Micro light-emitting diode

Etch profile control of via opening

Semiconductor device structure with conductive via structure and me...

Micro light-emitting device

Etch profile control of via opening

Etch profile control of gate contact opening

Etch profile control of gate contact opening

Light-emitting semiconductor structure and light-emitting semicondu...

Etch profile control of gate contact opening

Wafter, wafer testing system, and method thereof

Heating apparatus and chemical vapor deposition system

Micro semiconductor device

Metal shielding layer in backside illumination image sensor chips a...

Method of electroplating metal into recessed feature and electropla...

Semiconductor structure and manufacturing method for the same

Method of electroplating metal into recessed feature and electropla...

Light emitting device

Patterned substrate and light emitting diode wafer

Nitride semiconductor structure and semiconductor light emitting de...

Patents Applicationslast 30 patents

CHIP-ON-WAFER-ON-SUBSTRATE PACKAGE WITH IMPROVED YIELD

DEVICE WITH CONTROLLED GATE CONTACT PROFILE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

CONTACTS FOR SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

INTER BLOCK FOR RECESSED CONTACTS AND METHODS FORMING SAME

TEST STRUCTURES TO DETERMINE INTEGRATED CIRCUIT BONDING ENERGIES AN...

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE

SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...

Bridge Die Having Different Surface Orientation Than Ic Dies Interc...

ETCH PROFILE CONTROL OF VIA OPENING

INTERPOSER INCLUDING STEPPED SURFACES AND METHODS OF FORMING THE SAME

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

CHEMICAL MECHANICAL POLISHING APPARATUS WITH INTEGRATED SLURRY MIXE...

ETCH PROFILE CONTROL OF VIA OPENING

HEATING APPARATUS AND CHEMICAL VAPOR DEPOSITION SYSTEM

INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF

ETCH PROFILE CONTROL OF GATE CONTACT OPENING

MICRO LIGHT-EMITTING DIODE

ETCH PROFILE CONTROL OF GATE CONTACT OPENING

SEGMENTATION METHOD FOR LIPID DROPLET IN PATHOLOGICAL SLICE IMAGE

CHIP-ON-WAFER-ON-SUBSTRATE PACKAGE WITH IMPROVED YIELD

Method Forming Gate Stacks Adopting Thin Silicon Cap

ETCH PROFILE CONTROL OF GATE CONTACT OPENING

Transistor Gate Structures and Methods of Forming the Same

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

MICRO LIGHT EMITTING DIODE CHIP

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND ME...

INTER BLOCK FOR RECESSED CONTACTS AND METHODS FORMING SAME

RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME