Jyun-Liang WU

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,947,716
- Issue date Apr 17, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,875,912
- Issue date Jan 23, 2018
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170148844
- Publication date May 25, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170148694
- Publication date May 25, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170110495
- Publication date Apr 20, 2017
- XINTEC INC.
- Jyun-Liang WU
- H01 - BASIC ELECTRIC ELEMENTS