TREA

Jyun-Ping Jiang

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  • Taipei, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Sensor package structure
    • Patent number 12,256,573
    • Issue date Mar 18, 2025
    • Tong Hsing Electronic Industries, Ltd.
    • Chia-Shuai Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Output buffer circuit with enhanced slew rate
    • Patent number 8,289,302
    • Issue date Oct 16, 2012
    • Himax Technologies Limited
    • Yi-Jan Emry Chen
    • H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

  • Information Patent Application

    SENSOR PACKAGE STRUCTURE AND SENSING MODULE THEREOF
    • Publication number 20250040275
    • Publication date Jan 30, 2025
    • TONG HSING ELECTRONIC INDUSTRIES, LTD.
    • CHIEN-HUNG LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SENSOR PACKAGE STRUCTURE
    • Publication number 20240290897
    • Publication date Aug 29, 2024
    • TONG HSING ELECTRONIC INDUSTRIES, LTD.
    • CHIA-SHUAI CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SENSOR PACKAGE STRUCTURE
    • Publication number 20240128139
    • Publication date Apr 18, 2024
    • TONG HSING ELECTRONIC INDUSTRIES, LTD.
    • WEI-LI WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Output Buffer Circuit with Enhanced Slew Rate
    • Publication number 20100171727
    • Publication date Jul 8, 2010
    • Yi-Jan Emry Chen
    • H03 - BASIC ELECTRONIC CIRCUITRY