Jyunji Oyama

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Tsuzuki-gun, JP

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Patents Grantslast 30 patents

Information Patent Grant
Sealing structure and method of sealing electronic component
- Patent number 6,048,433
- Issue date Apr 11, 2000
- Murata Manufacturing Co., Ltd.
- Michinobu Maesaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing structure and method of sealing electronic component
- Patent number 5,886,457
- Issue date Mar 23, 1999
- Murata Manufacturing Co., Ltd.
- Michinobu Maesaka
- H01 - BASIC ELECTRIC ELEMENTS