Ka-Eun CHAE

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Chungcheongnam-do, KR

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE CIRCUIT BOARD AND METHOD OF FORMING THE SAME
- Publication number 20090126979
- Publication date May 21, 2009
- Samsung Electronics Co., Ltd.
- Ka-Eun CHAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR