Kabir J. Mirpuri

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate pad and die pillar design modifications to enable extreme...
- Patent number 12,199,064
- Issue date Jan 14, 2025
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package thermal spreader having integrated EF/EMI shi...
- Patent number 11,935,809
- Issue date Mar 19, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad and die pillar design modifications to enable extreme...
- Patent number 11,875,988
- Issue date Jan 16, 2024
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having thermal dissipation feature and...
- Patent number 11,817,366
- Issue date Nov 14, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package connector structure and method therefor
- Patent number 11,721,642
- Issue date Aug 8, 2023
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having integrated antenna and method therefor
- Patent number 11,705,410
- Issue date Jul 18, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package thermal spreader having integrated RF/EMI shi...
- Patent number 11,557,525
- Issue date Jan 17, 2023
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Space efficient flip chip joint design
- Patent number 11,521,947
- Issue date Dec 6, 2022
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power die package
- Patent number 11,515,238
- Issue date Nov 29, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature solder paste
- Patent number 10,391,590
- Issue date Aug 27, 2019
- Intel Corporation
- Kabir J. Mirpuri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High temperature solder paste
- Patent number 10,086,479
- Issue date Oct 2, 2018
- Intel Corporation
- Kabir J. Mirpuri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Water soluble flux with modified viscosity
- Patent number 10,037,898
- Issue date Jul 31, 2018
- Intel Corporation
- Kabir J. Mirpuri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
REUSABLE MODULAR SUBSTRATE
- Publication number 20250063657
- Publication date Feb 20, 2025
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...
- Publication number 20240113069
- Publication date Apr 4, 2024
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED EF/EMI SHI...
- Publication number 20230106555
- Publication date Apr 6, 2023
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE CONNECTOR STRUCTURE AND METHOD THEREFOR
- Publication number 20220406728
- Publication date Dec 22, 2022
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED RF/EMI SHI...
- Publication number 20220384299
- Publication date Dec 1, 2022
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...
- Publication number 20220352115
- Publication date Nov 3, 2022
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...
- Publication number 20220344235
- Publication date Oct 27, 2022
- NXP USA, Inc.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED ANTENNA AND METHOD THEREFOR
- Publication number 20220189890
- Publication date Jun 16, 2022
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...
- Publication number 20220181230
- Publication date Jun 9, 2022
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DIE PACKAGE
- Publication number 20200411423
- Publication date Dec 31, 2020
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOID REDUCTION IN SOLDER JOINTS USING OFF-EUTECTIC SOLDER
- Publication number 20190067176
- Publication date Feb 28, 2019
- Intel Corporation
- Kabir J. Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE SOLDER PASTE
- Publication number 20180361517
- Publication date Dec 20, 2018
- Intel Corporation
- Kabir J. Mirpuri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATER SOLUBLE FLUX WITH MODIFIED VISCOSITY
- Publication number 20170287732
- Publication date Oct 5, 2017
- Intel Corporation
- Kabir J. Mirpuri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH TEMPERATURE SOLDER PASTE
- Publication number 20170278818
- Publication date Sep 28, 2017
- Intel Corporation
- Kabir J. Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY (BGA) APPARATUS AND METHODS
- Publication number 20170066088
- Publication date Mar 9, 2017
- Intel Corporation
- Mohit Sood
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Kabir J. Mirpuri

Person

Patents Grantslast 30 patents

Substrate pad and die pillar design modifications to enable extreme...

Semiconductor package thermal spreader having integrated EF/EMI shi...

Substrate pad and die pillar design modifications to enable extreme...

Semiconductor device package having thermal dissipation feature and...

Semiconductor device package connector structure and method therefor

Semiconductor device having integrated antenna and method therefor

Semiconductor package thermal spreader having integrated RF/EMI shi...

Space efficient flip chip joint design

Power die package

High temperature solder paste

High temperature solder paste

Water soluble flux with modified viscosity

Patents Applicationslast 30 patents

REUSABLE MODULAR SUBSTRATE

SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...

SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED EF/EMI SHI...

SEMICONDUCTOR DEVICE PACKAGE CONNECTOR STRUCTURE AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED RF/EMI SHI...

SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...

SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...

SEMICONDUCTOR DEVICE HAVING INTEGRATED ANTENNA AND METHOD THEREFOR

SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...

POWER DIE PACKAGE

VOID REDUCTION IN SOLDER JOINTS USING OFF-EUTECTIC SOLDER

HIGH TEMPERATURE SOLDER PASTE

WATER SOLUBLE FLUX WITH MODIFIED VISCOSITY

HIGH TEMPERATURE SOLDER PASTE

BALL GRID ARRAY (BGA) APPARATUS AND METHODS