Kabirkumar Mirpuri

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Separation method, computer storage medium, and separation system
- Patent number 10,008,419
- Issue date Jun 26, 2018
- Tokyo Electron Limited
- Shinji Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-on-die using water-soluble resist system and method
- Patent number 9,659,889
- Issue date May 23, 2017
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluxing-encapsulant material for microelectronic packages assembled...
- Patent number 9,504,168
- Issue date Nov 22, 2016
- Intel Corporation
- Sivakumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder attach apparatus and method
- Patent number 9,324,680
- Issue date Apr 26, 2016
- Intel Corporation
- Kabirkumar Mirpuri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE ON SUBSTRATE PACKAGE
- Publication number 20170053858
- Publication date Feb 23, 2017
- Intel Corporation
- Jan Krajniak
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...
- Publication number 20170042043
- Publication date Feb 9, 2017
- SIVAKUMAR NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
- Publication number 20160260679
- Publication date Sep 8, 2016
- Intel Corporation
- Kabirkumar J. Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ATTACH APPARATUS AND METHOD
- Publication number 20160240506
- Publication date Aug 18, 2016
- Intel Corporation
- Kabirkumar Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD
- Publication number 20150179595
- Publication date Jun 25, 2015
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ATTACH APPARATUS AND METHOD
- Publication number 20150077962
- Publication date Mar 19, 2015
- Kabirkumar Mirpuri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR AVOIDING PROTRUSIONS IN INJECTION MOLDED SO...
- Publication number 20150001706
- Publication date Jan 1, 2015
- Kabirkumar Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...
- Publication number 20130263446
- Publication date Oct 10, 2013
- Intel Corporation
- Sivakumar Nagarajan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Kabirkumar Mirpuri

Person

Patents Grantslast 30 patents

Separation method, computer storage medium, and separation system

Solder-on-die using water-soluble resist system and method

Fluxing-encapsulant material for microelectronic packages assembled...

Solder attach apparatus and method

Patents Applicationslast 30 patents

SUBSTRATE ON SUBSTRATE PACKAGE

FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...

HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH

SOLDER ATTACH APPARATUS AND METHOD

SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD

SOLDER ATTACH APPARATUS AND METHOD

SYSTEMS AND METHODS FOR AVOIDING PROTRUSIONS IN INJECTION MOLDED SO...

FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...