Kah Wee Gan

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Muar, MY

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Patents Grantslast 30 patents

Information Patent Grant
Through hole via filling using electroless plating
- Patent number 8,766,422
- Issue date Jul 1, 2014
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer warpage adjustment
- Patent number 8,728,831
- Issue date May 20, 2014
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through hole via filling using electroless plating
- Patent number 8,617,987
- Issue date Dec 31, 2013
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
THROUGH HOLE VIA FILLING USING ELECTROLESS PLATING
- Publication number 20120168944
- Publication date Jul 5, 2012
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA TREATMENT ON SEMICONDUCTOR WAFERS
- Publication number 20120168943
- Publication date Jul 5, 2012
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER WARPAGE ADJUSTMENT
- Publication number 20120171875
- Publication date Jul 5, 2012
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH HOLE VIA FILLING USING ELECTROLESS PLATING
- Publication number 20120168942
- Publication date Jul 5, 2012
- STMicroelectronics Pte Ltd
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS