Kai-Bin WU

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package assembly with through silicon via interconnect
- Patent number 9,947,624
- Issue date Apr 17, 2018
- Mediatek Inc.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly with through silicon via interconnect
- Patent number 9,570,399
- Issue date Feb 14, 2017
- Mediatek Inc.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for performing delay-locked loop operation on...
- Patent number 8,565,288
- Issue date Oct 22, 2013
- Realtek Semiconductor Corp.
- Kai-Di Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY WITH THROUGH SILICON VIA INTERCONNECT
- Publication number 20170110406
- Publication date Apr 20, 2017
- MEDIATEK INC.
- Ming-Tzong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY WITH THROUGH SILICON VIA INTERCONNECT
- Publication number 20160181201
- Publication date Jun 23, 2016
- MEDIATEK INC.
- Ming-Tzong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PERFORMING DELAY-LOCKED LOOP OPERATION ON...
- Publication number 20110216812
- Publication date Sep 8, 2011
- Kai-Di Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE