Kai C. Ng

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East Meadow, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Die-up integrated circuit package with grounded stiffener
- Patent number 7,573,131
- Issue date Aug 11, 2009
- Compass Technology Co., Ltd.
- Cheng Qiang Cui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Die-up integrated circuit package with grounded stiffener
- Publication number 20080099898
- Publication date May 1, 2008
- Compass Technology Co., Ltd.
- Cheng Qiang Cui
- H01 - BASIC ELECTRIC ELEMENTS