Kai Chat Tan

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Tangkak, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with grounding device and related methods
- Patent number 10,699,989
- Issue date Jun 30, 2020
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with grounding device and related methods
- Patent number 10,056,317
- Issue date Aug 21, 2018
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH GROUNDING DEVICE AND RELATED METHODS
- Publication number 20190122963
- Publication date Apr 25, 2019
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR EXTENDING DIE SIZE AND PACKAGED SEMICONDUCTOR...
- Publication number 20160104662
- Publication date Apr 14, 2016
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS