Kai-Chiang Wu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,692
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,131,986
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,132,247
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with reinforcement structures in a redistribution...
- Patent number 12,119,303
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,080,563
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and forming methods thereof
- Patent number 12,062,619
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with antenna pattern
- Patent number 12,057,358
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Ta Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 12,046,480
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shou Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory apparatus and data rearrangement method for computing in memory
- Patent number 12,045,493
- Issue date Jul 23, 2024
- Skymizer Taiwan Inc.
- Shu-Ming Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages having a die, an encapsulant, and a redistri...
- Patent number 12,021,047
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heater lift assembly spring damper
- Patent number 12,009,232
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing circuit and fault-mitigating method
- Patent number 11,977,432
- Issue date May 7, 2024
- Skymizer Taiwan Inc.
- Shu-Ming Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Data processing circuit and fault mitigating method
- Patent number 11,978,526
- Issue date May 7, 2024
- Skymizer Taiwan Inc.
- Shu-Ming Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Package structure with improved antenna patterns performance
- Patent number 11,973,038
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,955,484
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile control of gate structures in semiconductor devices
- Patent number 11,948,939
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,908,787
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,818
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electro mechanical system and manufacturing method thereof
- Patent number 11,851,321
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,854,992
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,855,011
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Yi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with reinforcement structures in a redistribution...
- Patent number 11,824,005
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 11,749,626
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,742,219
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component, semiconductor package and manufacturing method t...
- Patent number 11,682,619
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,682,629
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aperture design and methods thereof
- Patent number 11,656,391
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chih Hsieh
- G02 - OPTICS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,658,105
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution lines having nano columns and method forming same
- Patent number 11,594,508
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDISTRIBUTION LINES HAVING NANO COLUMNS AND METHOD FORMING SAME
- Publication number 20240387433
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387979
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379519
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
- Publication number 20240379382
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHOU ZEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND FORMING METHODS THEREOF
- Publication number 20240363544
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANOPTIC PERCEPTION SYSTEM, METHOD THEREOF AND NON-TRANSITORY COMPU...
- Publication number 20240362470
- Publication date Oct 31, 2024
- Macronix International Co., Ltd.
- Yu-Chen LU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
- Publication number 20240363366
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH ANTENNA PATTERN AND METHOD OF FORMING THE SAME
- Publication number 20240363459
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Ta Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL GROUNDING IN BACKSIDE POWER SCHEMES USING CARRIER WAFERS
- Publication number 20240332126
- Publication date Oct 3, 2024
- Intel Corporation
- Andy Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER LIFT ASSEMBLY SPRING DAMPER
- Publication number 20240304471
- Publication date Sep 12, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Kai-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...
- Publication number 20240297131
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258312
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240234329
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240170386
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240088070
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240083742
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088053
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAULT-MITIGATING METHOD AND DATA PROCESSING CIRCUIT
- Publication number 20240028452
- Publication date Jan 25, 2024
- Skymizer Taiwan Inc.
- Shu-Ming Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY APPARATUS AND DATA REARRANGEMENT METHOD FOR COMPUTING IN MEMORY
- Publication number 20240028245
- Publication date Jan 25, 2024
- Skymizer Taiwan Inc.
- Shu-Ming Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021738
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- ANHAO CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMPLIFICATION DEVICE AND SIMPLIFICATION METHOD FOR NEURAL NETWORK...
- Publication number 20240005159
- Publication date Jan 4, 2024
- NEUCHIPS CORPORATION
- Po-Han Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNI...
- Publication number 20230387074
- Publication date Nov 30, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Profile Control Of Gate Structures In Semiconductor Devices
- Publication number 20230387111
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Chi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNI...
- Publication number 20230387073
- Publication date Nov 30, 2023
- Intel Corporation
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230378073
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
- Publication number 20230369259
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260899
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260885
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Lines Having Nano Columns and Method Forming Same
- Publication number 20230154880
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ONLINE SIGNING SYSTEM AND METHOD, COMPUTING APPARATUS, AND COMPUTER...
- Publication number 20230138504
- Publication date May 4, 2023
- Kdan Mobile Software Ltd.
- Po-Chou Su
- G06 - COMPUTING CALCULATING COUNTING

Kai-Chiang Wu

Person

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Package structure with reinforcement structures in a redistribution...

Semiconductor devices and methods of manufacturing

Semiconductor packages and forming methods thereof

Package structure with antenna pattern

Manufacturing method of a semiconductor device

Memory apparatus and data rearrangement method for computing in memory

Semiconductor packages having a die, an encapsulant, and a redistri...

Heater lift assembly spring damper

Data processing circuit and fault-mitigating method

Data processing circuit and fault mitigating method

Package structure with improved antenna patterns performance

Semiconductor device and manufacturing method thereof

Profile control of gate structures in semiconductor devices

Package structure and method of manufacturing the same

Semiconductor device

Methods of manufacturing a semiconductor device including a joint a...

Micro-electro mechanical system and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Package structure and method of forming the same

Package structure with reinforcement structures in a redistribution...

Integrated devices in semiconductor packages and methods of forming...

Integrated fan-out package and manufacturing method thereof

Package component, semiconductor package and manufacturing method t...

Package structure and manufacturing method thereof

Aperture design and methods thereof

Semiconductor package and manufacturing method thereof

Redistribution lines having nano columns and method forming same

Patents Applicationslast 30 patents

REDISTRIBUTION LINES HAVING NANO COLUMNS AND METHOD FORMING SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND FORMING METHODS THEREOF

PANOPTIC PERCEPTION SYSTEM, METHOD THEREOF AND NON-TRANSITORY COMPU...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

PACKAGE STRUCTURE WITH ANTENNA PATTERN AND METHOD OF FORMING THE SAME

THERMAL GROUNDING IN BACKSIDE POWER SCHEMES USING CARRIER WAFERS

HEATER LIFT ASSEMBLY SPRING DAMPER

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

FAULT-MITIGATING METHOD AND DATA PROCESSING CIRCUIT

MEMORY APPARATUS AND DATA REARRANGEMENT METHOD FOR COMPUTING IN MEMORY

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SIMPLIFICATION DEVICE AND SIMPLIFICATION METHOD FOR NEURAL NETWORK...

INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNI...

Profile Control Of Gate Structures In Semiconductor Devices

INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNI...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Integrated Devices in Semiconductor Packages and Methods of Forming...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Redistribution Lines Having Nano Columns and Method Forming Same

ONLINE SIGNING SYSTEM AND METHOD, COMPUTING APPARATUS, AND COMPUTER...