Kai-Chiang Wu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,955,484
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile control of gate structures in semiconductor devices
- Patent number 11,948,939
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,908,787
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,818
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electro mechanical system and manufacturing method thereof
- Patent number 11,851,321
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,854,992
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,855,011
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Yi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with reinforcement structures in a redistribution...
- Patent number 11,824,005
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 11,749,626
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,742,219
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component, semiconductor package and manufacturing method t...
- Patent number 11,682,619
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,682,629
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aperture design and methods thereof
- Patent number 11,656,391
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chih Hsieh
- G02 - OPTICS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,658,105
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution lines having nano columns and method forming same
- Patent number 11,594,508
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,574,857
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,569,562
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,569,190
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,515,274
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 11,515,173
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing circuit and fault-mitigating method
- Patent number 11,461,204
- Issue date Oct 4, 2022
- Skymizer Taiwan Inc.
- Shu-Ming Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package, package structure with redistributing circuits and antenna...
- Patent number 11,424,197
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,417,616
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,404,413
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer layers embedded with metal pads for heat dissipation
- Patent number 11,398,440
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabricating method thereof
- Patent number 11,398,422
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal through vias (TTV)
- Patent number 11,373,922
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heater lift assembly spring damper
- Patent number 11,367,632
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,362,009
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Ta Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240083742
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240088070
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088053
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAULT-MITIGATING METHOD AND DATA PROCESSING CIRCUIT
- Publication number 20240028452
- Publication date Jan 25, 2024
- Skymizer Taiwan Inc.
- Shu-Ming Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY APPARATUS AND DATA REARRANGEMENT METHOD FOR COMPUTING IN MEMORY
- Publication number 20240028245
- Publication date Jan 25, 2024
- Skymizer Taiwan Inc.
- Shu-Ming Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021738
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- ANHAO CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNI...
- Publication number 20230387074
- Publication date Nov 30, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Profile Control Of Gate Structures In Semiconductor Devices
- Publication number 20230387111
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Chi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNI...
- Publication number 20230387073
- Publication date Nov 30, 2023
- Intel Corporation
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230378073
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
- Publication number 20230369259
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260899
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260885
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Lines Having Nano Columns and Method Forming Same
- Publication number 20230154880
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ONLINE SIGNING SYSTEM AND METHOD, COMPUTING APPARATUS, AND COMPUTER...
- Publication number 20230138504
- Publication date May 4, 2023
- Kdan Mobile Software Ltd.
- Po-Chou Su
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Devices and Methods of Manufacturing
- Publication number 20230091737
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing CO.,LTD.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PROCESSING CIRCUIT AND FAULT MITIGATING METHOD
- Publication number 20230077991
- Publication date Mar 16, 2023
- Skymizer Taiwan Inc.
- Shu-Ming Liu
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220359977
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PROCESSING CIRCUIT AND FAULT-MITIGATING METHOD
- Publication number 20220342736
- Publication date Oct 27, 2022
- Skymizer Taiwan Inc.
- Shu-Ming Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220336385
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336386
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER LIFT ASSEMBLY SPRING DAMPER
- Publication number 20220319880
- Publication date Oct 6, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Kai-Wen WU
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Application
Polymer Layers Embedded with Metal Pads for Heat Dissipation
- Publication number 20220320024
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220320020
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220302110
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...
- Publication number 20220285241
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20220274827
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE WITH ANTENNA PATTERN
- Publication number 20220270944
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Ta Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND FORMING METHODS THEREOF
- Publication number 20220262734
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220254722
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Kai-Chiang Wu

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Profile control of gate structures in semiconductor devices

Package structure and method of manufacturing the same

Semiconductor device

Methods of manufacturing a semiconductor device including a joint a...

Micro-electro mechanical system and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Package structure and method of forming the same

Package structure with reinforcement structures in a redistribution...

Integrated devices in semiconductor packages and methods of forming...

Integrated fan-out package and manufacturing method thereof

Package component, semiconductor package and manufacturing method t...

Package structure and manufacturing method thereof

Aperture design and methods thereof

Semiconductor package and manufacturing method thereof

Redistribution lines having nano columns and method forming same

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor devices and methods of manufacturing

Data processing circuit and fault-mitigating method

Package, package structure with redistributing circuits and antenna...

Package structure and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Polymer layers embedded with metal pads for heat dissipation

Package structure and fabricating method thereof

Semiconductor packages having thermal through vias (TTV)

Heater lift assembly spring damper

Package structure and method of fabricating the same

Patents Applicationslast 30 patents

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

FAULT-MITIGATING METHOD AND DATA PROCESSING CIRCUIT

MEMORY APPARATUS AND DATA REARRANGEMENT METHOD FOR COMPUTING IN MEMORY

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNI...

Profile Control Of Gate Structures In Semiconductor Devices

INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNI...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Integrated Devices in Semiconductor Packages and Methods of Forming...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Redistribution Lines Having Nano Columns and Method Forming Same

ONLINE SIGNING SYSTEM AND METHOD, COMPUTING APPARATUS, AND COMPUTER...

Semiconductor Devices and Methods of Manufacturing

DATA PROCESSING CIRCUIT AND FAULT MITIGATING METHOD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DATA PROCESSING CIRCUIT AND FAULT-MITIGATING METHOD

PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

HEATER LIFT ASSEMBLY SPRING DAMPER

Polymer Layers Embedded with Metal Pads for Heat Dissipation

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE WITH ANTENNA PATTERN

SEMICONDUCTOR PACKAGES AND FORMING METHODS THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF