Kai Chong Chan

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding structures of semiconductor devices
- Patent number 11,444,045
- Issue date Sep 13, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stack protection seal
- Patent number 9,768,089
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge structure for backgrinding asymmetrical bonded wafer
- Patent number 9,761,561
- Issue date Sep 12, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stack protection seal
- Patent number 9,406,577
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device for radio frequency applications and method fo...
- Patent number 8,610,266
- Issue date Dec 17, 2013
- Infineon Technologies AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with core region and bond pad a...
- Patent number 8,603,909
- Issue date Dec 10, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating method for crack stop structure enhancement of integrat...
- Patent number 8,048,761
- Issue date Nov 1, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for producing the same
- Patent number 8,003,448
- Issue date Aug 23, 2011
- Infineon Technologies, AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system and method of manufacture thereof
- Patent number 7,892,963
- Issue date Feb 22, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for producing the same
- Patent number 7,816,235
- Issue date Oct 19, 2010
- Infineon Technologies AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel and semiconductor component having a composite board with sem...
- Patent number 7,619,304
- Issue date Nov 17, 2009
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with semiconductor chip and adhesive film,...
- Patent number 7,535,111
- Issue date May 19, 2009
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with contact support layer and method to prod...
- Patent number 7,452,747
- Issue date Nov 18, 2008
- Infineon Technologies AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Inverted EWLB Package wi...
- Publication number 20250006608
- Publication date Jan 2, 2025
- STATS ChipPAC Pte Ltd.
- Linda Pei Ee Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH COPPER BOND PAD AND COPPER INTERCONNECT
- Publication number 20240178165
- Publication date May 30, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Ranjan RAJOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF SEMICONDUCTOR DEVICES
- Publication number 20220052000
- Publication date Feb 17, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- RAMASAMY CHOCKALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACK PROTECTION SEAL
- Publication number 20160343629
- Publication date Nov 24, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Ranjan RAJOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE STRUCTURE FOR BACKGRINDING ASYMMETRICAL BONDED WAFER
- Publication number 20160276310
- Publication date Sep 22, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Ranjan RAJOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACK PROTECTION SEAL
- Publication number 20140264762
- Publication date Sep 18, 2014
- GLOBAL FOUNDRIES SINGAPORE PTE LTD.
- Ranjan RAJOO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CRACK STOP STRUCTURE ENHANCEMENT OF THE INTEGRATED CIRCUIT SEAL RING
- Publication number 20120074519
- Publication date Mar 29, 2012
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BOND PAD AND METHOD OF MAN...
- Publication number 20110101545
- Publication date May 5, 2011
- Chartered Semiconductor Manufacturing LTD.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Producing the Same
- Publication number 20100314721
- Publication date Dec 16, 2010
- INFINEON TECHNOLOGIES AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
- Publication number 20100270670
- Publication date Oct 28, 2010
- Chartered Semiconductor Manufacturing LTD.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Crack stop structure enhancement of the integrated circuit seal ring
- Publication number 20100207237
- Publication date Aug 19, 2010
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Alfred Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Producing the Same
- Publication number 20080006900
- Publication date Jan 10, 2008
- Infineon Technologies AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT WITH SEMICONDUCTOR CHIP AND ADHESIVE FILM,...
- Publication number 20070187816
- Publication date Aug 16, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device for radio frequency applications and method fo...
- Publication number 20070075410
- Publication date Apr 5, 2007
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with contact support layer and method to prod...
- Publication number 20070037319
- Publication date Feb 15, 2007
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Panel and semiconductor component having a composite board with sem...
- Publication number 20060278972
- Publication date Dec 14, 2006
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Kai Chong Chan

Person

Patents Grantslast 30 patents

Bonding structures of semiconductor devices

Wafer stack protection seal

Edge structure for backgrinding asymmetrical bonded wafer

Wafer stack protection seal

Semiconductor device for radio frequency applications and method fo...

Integrated circuit packaging system with core region and bond pad a...

Fabricating method for crack stop structure enhancement of integrat...

Semiconductor package and method for producing the same

Integrated circuit packaging system and method of manufacture thereof

Semiconductor package and method for producing the same

Panel and semiconductor component having a composite board with sem...

Semiconductor component with semiconductor chip and adhesive film,...

Semiconductor package with contact support layer and method to prod...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Inverted EWLB Package wi...

STRUCTURE WITH COPPER BOND PAD AND COPPER INTERCONNECT

BONDING STRUCTURES OF SEMICONDUCTOR DEVICES

WAFER STACK PROTECTION SEAL

EDGE STRUCTURE FOR BACKGRINDING ASYMMETRICAL BONDED WAFER

WAFER STACK PROTECTION SEAL

CRACK STOP STRUCTURE ENHANCEMENT OF THE INTEGRATED CIRCUIT SEAL RING

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BOND PAD AND METHOD OF MAN...

Semiconductor Package and Method for Producing the Same

INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF

Crack stop structure enhancement of the integrated circuit seal ring

Semiconductor Package and Method for Producing the Same

SEMICONDUCTOR COMPONENT WITH SEMICONDUCTOR CHIP AND ADHESIVE FILM,...

Semiconductor device for radio frequency applications and method fo...

Semiconductor package with contact support layer and method to prod...

Panel and semiconductor component having a composite board with sem...