Kai-Chun Hsu

Person

Yonghe City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device and semiconductor devices
- Patent number 12,148,656
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 12,020,947
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-An Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 11,996,433
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blockchain creation method, computing device, and storage medium
- Patent number 11,985,249
- Issue date May 14, 2024
- Hon Hai Precision Industry Co., Ltd.
- Kai-Ti Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
- Patent number 11,967,522
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual polarization log-periodic antenna apparatus
- Patent number 11,949,157
- Issue date Apr 2, 2024
- GRAND-TEK TECHNOLOGY CO., LTD.
- Kai-Hsiung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor comprising polysilicon gate electrode and nitride hard...
- Patent number 11,837,622
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming image sensor
- Patent number 11,444,116
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 11,322,540
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices including formation o...
- Patent number 11,322,397
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiao-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
- Patent number 11,315,829
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electron migration control in interconnect structures
- Patent number 11,264,273
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 11,222,915
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 11,069,534
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui-An Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum-containing layers and methods of forming the same
- Patent number 10,978,337
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyh-nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Image sensor
- Patent number 10,879,305
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for front side illuminated image sensor
- Patent number 10,833,119
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal chemical vapor deposition system and operating method thereof
- Patent number 10,724,140
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Chan Lo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition device structure
- Patent number 10,626,499
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Chan Lo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Configuration and measurement method for performing a full-duplex c...
- Patent number 10,547,435
- Issue date Jan 28, 2020
- Industrial Technology Research Institute
- Kai-Cheng Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of forming polysilicon gate structure in image sensor device
- Patent number 10,204,960
- Issue date Feb 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wei Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal chemical vapor deposition system and operating method thereof
- Patent number 10,161,041
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Chan Lo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor arrangement and formation thereof
- Patent number 10,103,287
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming alignment marks and structure of same
- Patent number 10,074,612
- Issue date Sep 11, 2018
- Taiwan Semiconductor Manufacturing Company
- Cheng-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy management strategy for boats and ships
- Patent number 10,046,651
- Issue date Aug 14, 2018
- Ship and Ocean Industries R&D Center
- Chih-Hung Lin
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Data transmission method for performing full-duplex communications...
- Patent number 10,044,491
- Issue date Aug 7, 2018
- Industrial Technology Research Institute
- Kai-Cheng Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for relaying signal and relay using the same
- Patent number 9,876,559
- Issue date Jan 23, 2018
- Industrial Technology Research Insitute
- Kai-Cheng Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Selective inhibitors for protein kinases and pharmaceutical composi...
- Patent number 9,738,660
- Issue date Aug 22, 2017
- National Chiao Tung University
- Jinn-Moon Yang
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Interlayer dielectric structure with high aspect ratio process (HARP)
- Patent number 9,716,044
- Issue date Jul 25, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming alignment marks and structure of same
- Patent number 9,627,326
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD
- Publication number 20240384404
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Wei XU
- B08 - CLEANING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240312792
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-An HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMORPHOUS LAYERS FOR REDUCING COPPER DIFFUSION AND METHOD FORMING SAME
- Publication number 20240258160
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DUAL POLARIZATION LOG-PERIODIC ANTENNA APPARATUS
- Publication number 20240079788
- Publication date Mar 7, 2024
- GRAND-TEK TECHNOLOGY CO., LTD.
- Kai-Hsiung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES
- Publication number 20230377955
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE CONFIGURED TO REDUCE CROSS TALK IN IMAGE SENSOR
- Publication number 20230326951
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES IN IMAGE SENSORS
- Publication number 20230317758
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT VALVE AIR CURTAIN
- Publication number 20230142009
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jia-Wei XU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMAGE SENSOR
- Publication number 20220384514
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei CHIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD
- Publication number 20220333236
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jia-Wei XU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES
- Publication number 20220262677
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Min CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR
- Publication number 20220254828
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Amorphous Layers for Reducing Copper Diffusion and Method Forming Same
- Publication number 20220254679
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BLOCKCHAIN CREATION METHOD, COMPUTING DEVICE, AND STORAGE MEDIUM
- Publication number 20220209957
- Publication date Jun 30, 2022
- HON HAI PRECISION INDUSTRY CO., LTD.
- KAI-TI HSU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES
- Publication number 20220181203
- Publication date Jun 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20210351041
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-An HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES
- Publication number 20210233805
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING IMAGE SENSOR
- Publication number 20210118939
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei CHIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Amorphous Layers for Reducing Copper Diffusion and Method Forming Same
- Publication number 20210066122
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR
- Publication number 20210028219
- Publication date Jan 28, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20200135868
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-An HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES
- Publication number 20200135553
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Min CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum-Containing Layers and Methods of Forming the Same
- Publication number 20200090986
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhy-nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMAGE SENSOR
- Publication number 20190172870
- Publication date Jun 6, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei CHIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION DEVICE STRUCTURE
- Publication number 20190032215
- Publication date Jan 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chan LO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Thermal Chemical Vapor Deposition System and Operating Method Thereof
- Publication number 20180334747
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chan Lo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR
- Publication number 20180331146
- Publication date Nov 15, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA TRANSMISSION METHOD FOR PERFORMING FULL-DUPLEX COMMUNICATIONS...
- Publication number 20170264418
- Publication date Sep 14, 2017
- Industrial Technology Research Institute
- Kai-Cheng HSU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CONFIGURATION AND MEASUREMENT METHOD FOR PERFORMING A FULL-DUPLEX C...
- Publication number 20170264382
- Publication date Sep 14, 2017
- Industrial Technology Research Institute
- Kai-Cheng HSU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for Forming Alignment Marks and Structure of Same
- Publication number 20170207176
- Publication date Jul 20, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS

Kai-Chun Hsu

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device and semiconductor devices

Method of manufacturing semiconductor devices and semiconductor dev...

Pad structure for front side illuminated image sensor

Blockchain creation method, computing device, and storage medium

Amorphous layers for reducing copper diffusion and method forming same

Dual polarization log-periodic antenna apparatus

Image sensor comprising polysilicon gate electrode and nitride hard...

Method for forming image sensor

Pad structure for front side illuminated image sensor

Method of manufacturing semiconductor devices including formation o...

Amorphous layers for reducing copper diffusion and method forming same

Electron migration control in interconnect structures

Pad structure for front side illuminated image sensor

Method of manufacturing semiconductor devices and semiconductor dev...

Aluminum-containing layers and methods of forming the same

Image sensor

Pad structure for front side illuminated image sensor

Thermal chemical vapor deposition system and operating method thereof

Deposition device structure

Configuration and measurement method for performing a full-duplex c...

Method of forming polysilicon gate structure in image sensor device

Thermal chemical vapor deposition system and operating method thereof

Semiconductor arrangement and formation thereof

Method for forming alignment marks and structure of same

Energy management strategy for boats and ships

Data transmission method for performing full-duplex communications...

Method for relaying signal and relay using the same

Selective inhibitors for protein kinases and pharmaceutical composi...

Interlayer dielectric structure with high aspect ratio process (HARP)

Method for forming alignment marks and structure of same

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

AMORPHOUS LAYERS FOR REDUCING COPPER DIFFUSION AND METHOD FORMING SAME

DUAL POLARIZATION LOG-PERIODIC ANTENNA APPARATUS

ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES

ISOLATION STRUCTURE CONFIGURED TO REDUCE CROSS TALK IN IMAGE SENSOR

ISOLATION STRUCTURES IN IMAGE SENSORS

SPLIT VALVE AIR CURTAIN

IMAGE SENSOR

SEMICONDUCTOR MANUFACTURING APPARATUS WITH IMPROVED PRODUCTION YIELD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES

PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR

Amorphous Layers for Reducing Copper Diffusion and Method Forming Same

BLOCKCHAIN CREATION METHOD, COMPUTING DEVICE, AND STORAGE MEDIUM

ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES

METHOD FOR FORMING IMAGE SENSOR

Amorphous Layers for Reducing Copper Diffusion and Method Forming Same

PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES

Aluminum-Containing Layers and Methods of Forming the Same

IMAGE SENSOR

DEPOSITION DEVICE STRUCTURE

Thermal Chemical Vapor Deposition System and Operating Method Thereof

PAD STRUCTURE FOR FRONT SIDE ILLUMINATED IMAGE SENSOR

DATA TRANSMISSION METHOD FOR PERFORMING FULL-DUPLEX COMMUNICATIONS...

CONFIGURATION AND MEASUREMENT METHOD FOR PERFORMING A FULL-DUPLEX C...

Method for Forming Alignment Marks and Structure of Same