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Taichung, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Multi-gate semiconductor structure and method of manufacturing the...
Patent number
12,107,162
Issue date
Oct 1, 2024
Winbond Electronics Corp.
Hung-Yu Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
12,089,394
Issue date
Sep 10, 2024
Winbond Electronics Corp.
Chi-An Wang
Information
Patent Grant
Dynamic random access memory and method for manufacturing the same
Patent number
12,020,945
Issue date
Jun 25, 2024
Winbond Electronics Corp.
Kai Jen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,016,173
Issue date
Jun 18, 2024
Winbond Electronics Corp.
Te-Hsuan Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor structure having multi-work f...
Patent number
11,943,913
Issue date
Mar 26, 2024
Winbond Electronics Corp.
Te-Hsuan Peng
Information
Patent Grant
Manufacturing method for semiconductor device
Patent number
11,923,449
Issue date
Mar 5, 2024
Winbond Electronics Corp.
Hao-Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having layers in a trench and method of man...
Patent number
11,784,087
Issue date
Oct 10, 2023
Winbond Electronics Corp.
Hao Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing dynamic random access memory
Patent number
11,765,888
Issue date
Sep 19, 2023
Winbond Electronics Corp.
Yoshinori Tanaka
G11 - INFORMATION STORAGE
Information
Patent Grant
Method of manufacturing dynamic random-access memory
Patent number
11,665,879
Issue date
May 30, 2023
Winbond Electronics Corp.
Kai Jen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,495,605
Issue date
Nov 8, 2022
Winbond Electronics Corp.
Chi-An Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dynamic random-access memory
Patent number
11,430,792
Issue date
Aug 30, 2022
Winbond Electronics Corp.
Kai Jen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,367,787
Issue date
Jun 21, 2022
Winbond Electronics Corp.
Hao-Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dynamic random access memory and methods of manufacturing, writing...
Patent number
11,183,499
Issue date
Nov 23, 2021
Winbond Electronics Corp.
Yoshinori Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure with protection portions and method for for...
Patent number
11,101,179
Issue date
Aug 24, 2021
Winbond Electronics Corp.
Kai Jen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,018,140
Issue date
May 25, 2021
Winbond Electronics Corp.
Yi-Hao Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dynamic random access memory
Patent number
10,998,323
Issue date
May 4, 2021
Winbond Electronics Corp.
Kai Jen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory structure and method of manufacturing the same
Patent number
10,998,320
Issue date
May 4, 2021
Winbond Electronics Corp.
Kai Jen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory device with buried word line for reduced gate-induced drain...
Patent number
10,083,906
Issue date
Sep 25, 2018
Winbond Electronics Corp.
Kai Jen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FORMING THE SAME
Publication number
20240332418
Publication date
Oct 3, 2024
WINBOND ELECTRONICS CORP.
Yu-Ting CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240315000
Publication date
Sep 19, 2024
WINBOND ELECTRONICS CORP.
Yi-Hsun Chung
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20240312791
Publication date
Sep 19, 2024
WINBOND ELECTRONICS CORP.
Kai JEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20240292595
Publication date
Aug 29, 2024
WINBOND ELECTRONICS CORP.
Te-Hsuan Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240186396
Publication date
Jun 6, 2024
WINBOND ELECTRONICS CORP.
Shou-Chi TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING MULTI-WORK F...
Publication number
20230255020
Publication date
Aug 10, 2023
WINBOND ELECTRONICS CORP.
Te-Hsuan PENG
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230084548
Publication date
Mar 16, 2023
WINBOND ELECTRONICS CORP.
Te-Hsuan PENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20230012828
Publication date
Jan 19, 2023
WINBOND ELECTRONICS CORP.
Chi-An Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING DYNAMIC RANDOM-ACCESS MEMORY
Publication number
20220344342
Publication date
Oct 27, 2022
WINBOND ELECTRONICS CORP.
Kai Jen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20220262943
Publication date
Aug 18, 2022
WINBOND ELECTRONICS CORP.
Hao-Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20220068930
Publication date
Mar 3, 2022
WINBOND ELECTRONICS CORP.
Te-Hsuan Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20220068939
Publication date
Mar 3, 2022
WINBOND ELECTRONICS CORP.
Chi-An Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF MANUFACTURING DYNAMIC RANDOM ACCESS MEMORY
Publication number
20220028866
Publication date
Jan 27, 2022
WINBOND ELECTRONICS CORP.
Yoshinori Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DYNAMIC RANDOM ACCESS MEMORY AND METHOD FOR MANUFACTURING THE SAME
Publication number
20220005703
Publication date
Jan 6, 2022
WINBOND ELECTRONICS CORP.
Kai JEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20210398985
Publication date
Dec 23, 2021
WINBOND ELECTRONICS CORP.
Wei-Che CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-GATE SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE...
Publication number
20210257491
Publication date
Aug 19, 2021
WINBOND ELECTRONICS CORP.
Hung-Yu WEI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20210210376
Publication date
Jul 8, 2021
WINBOND ELECTRONICS CORP.
Hao Chuan CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20210143270
Publication date
May 13, 2021
WINBOND ELECTRONICS CORP.
Hao-Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS FOR FABRICATING THE SAME
Publication number
20210013104
Publication date
Jan 14, 2021
WINBOND ELECTRONICS CORP.
Kai JEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DYNAMIC RANDOM-ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAME
Publication number
20210013209
Publication date
Jan 14, 2021
WINBOND ELECTRONICS CORP.
Kai Jen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20200335506
Publication date
Oct 22, 2020
WINBOND ELECTRONICS CORP.
Yi-Hao CHIEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DYNAMIC RANDOM ACCESS MEMORY
Publication number
20200321342
Publication date
Oct 8, 2020
WINBOND ELECTRONICS CORP.
Kai Jen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20200312856
Publication date
Oct 1, 2020
WINBOND ELECTRONICS CORP.
Kai JEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING SAME
Publication number
20200185495
Publication date
Jun 11, 2020
WINBOND ELECTRONICS CORP.
Chien-Hsu TSENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DYNAMIC RANDOM ACCESS MEMORY AND METHODS OF MANUFACTURING, WRITING...
Publication number
20190393226
Publication date
Dec 26, 2019
WINBOND ELECTRONICS CORP.
Yoshinori Tanaka
H01 - BASIC ELECTRIC ELEMENTS