TREA

Kai-Jih SHIH

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  • Milpitas, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of forming package structure
    • Patent number 11,951,571
    • Issue date Apr 9, 2024
    • Integrated Silicon Solution Inc.
    • Cheng-Fu Yu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of forming package structure
    • Patent number 11,612,965
    • Issue date Mar 28, 2023
    • Integrated Silicon Solution Inc.
    • Cheng-Fu Yu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20240047313
    • Publication date Feb 8, 2024
    • Integrated Silicon Solution Inc.
    • Cheng-Fu YU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING PACKAGE STRUCTURE
    • Publication number 20230173615
    • Publication date Jun 8, 2023
    • Integrated Silicon Solution Inc.
    • Cheng-Fu YU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20220246501
    • Publication date Aug 4, 2022
    • Integrated Silicon Solution Inc.
    • Cheng-Fu YU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20210305136
    • Publication date Sep 30, 2021
    • Integrated Silicon Solution Inc.
    • Cheng-Fu YU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FORMING PACKAGE STRUCTURE
    • Publication number 20210299791
    • Publication date Sep 30, 2021
    • Integrated Silicon Solution Inc.
    • Cheng-Fu YU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR