Kai-Jun Zhan

Person

Taoyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip structure and method for forming the same
- Patent number 12,015,002
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 11,990,440
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of manufacture
- Patent number 11,978,720
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for forming a package structure
- Patent number 11,961,817
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductive pad
- Patent number 11,942,445
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including stress-resistant bonding structures and...
- Patent number 11,887,955
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer structures and methods of forming
- Patent number 11,742,204
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-connection structure and manufacturing method thereof
- Patent number 11,152,319
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,101,233
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-En Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer structures and methods of forming
- Patent number 11,004,685
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-connection structure and manufacturing method thereof
- Patent number 10,651,142
- Issue date May 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-connection structure and manufacturing method thereof
- Patent number 10,283,471
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING TOOL WITH TILTABLE BOND STAGE AND METHODS FOR PERFORMIN...
- Publication number 20250132284
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Amram EITAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240332235
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE
- Publication number 20240258266
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
- Publication number 20240258259
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20240222312
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...
- Publication number 20240194633
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
- Publication number 20240128219
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...
- Publication number 20230378123
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Structures and Methods of Forming
- Publication number 20230369049
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230067143
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
- Publication number 20230065797
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONDUCT...
- Publication number 20230063127
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20220278071
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE
- Publication number 20220238480
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONDUCTIVE PAD
- Publication number 20210384152
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-En YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Structures and Methods of Forming
- Publication number 20210265165
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200273827
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER STRUCTURES AND METHODS OF FORMING
- Publication number 20200176254
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190259719
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190139917
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS

Kai-Jun Zhan

Person

Patents Grantslast 30 patents

Chip structure and method for forming the same

Structure and formation method of semiconductor device with conduct...

Semiconductor device package and methods of manufacture

Apparatus and method for forming a package structure

Semiconductor device with conductive pad

Semiconductor die including stress-resistant bonding structures and...

Multi-layer structures and methods of forming

Micro-connection structure and manufacturing method thereof

Semiconductor device and method for forming the same

Multi-layer structures and methods of forming

Micro-connection structure and manufacturing method thereof

Micro-connection structure and manufacturing method thereof

Patents Applicationslast 30 patents

DIE BONDING TOOL WITH TILTABLE BOND STAGE AND METHODS FOR PERFORMIN...

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS

METHOD FOR FORMING A PACKAGE STRUCTURE

DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...

SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...

SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...

Multi-Layer Structures and Methods of Forming

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONDUCT...

APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE WITH CONDUCTIVE PAD

Multi-Layer Structures and Methods of Forming

MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTI-LAYER STRUCTURES AND METHODS OF FORMING

MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF