Kai Lin HUANG

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wire-bonding machine with cover-gas supply device
- Patent number 8,096,461
- Issue date Jan 17, 2012
- Advanced Semiconductor Engineering, Inc.
- Kai Lin Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE-BONDING MACHINE WITH COVER-GAS SUPPLY DEVICE
- Publication number 20110049219
- Publication date Mar 3, 2011
- Advanced Semiconductor Engineering, Inc.
- Kai Lin HUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR