Kai Lo

Person

  • Taipei City, TW

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    THERMALLY CONDUCTIVE BOARD

    • Publication number 20250042144
    • Publication date Feb 6, 2025
    • TCLAD TECHNOLOGY CORPORATION
    • Kai-Wei LO
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    THERMALLY CONDUCTIVE BOARD

    • Publication number 20240227358
    • Publication date Jul 11, 2024
    • POLYTRONICS TECHNOLOGY CORP.
    • KAI-WEI LO
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    THERMALLY CONDUCTIVE BOARD

    • Publication number 20240131819
    • Publication date Apr 25, 2024
    • POLYTRONICS TECHNOLOGY CORP.
    • KAI-WEI LO
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    METAL CLAD SUBSTRATE

    • Publication number 20230249438
    • Publication date Aug 10, 2023
    • POLYTRONICS TECHNOLOGY CORP.
    • KAI-WEI LO
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    INSULATED METAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

    • Publication number 20220270950
    • Publication date Aug 25, 2022
    • POLYTRONICS TECHNOLOGY CORP.
    • Feng-Chun YU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INSULATED METAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

    • Publication number 20220266572
    • Publication date Aug 25, 2022
    • POLYTRONICS TECHNOLOGY CORP.
    • Feng-Chun YU
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    THERMALLY CONDUCTIVE BOARD

    • Publication number 20220201856
    • Publication date Jun 23, 2022
    • POLYTRONICS TECHNOLOGY CORP.
    • KUO HSUN CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THERMALLY CONDUCTIVE BOARD

    • Publication number 20210059056
    • Publication date Feb 25, 2021
    • POLYTRONICS TECHNOLOGY CORP.
    • Kuo-Hsun CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR APPARATUS WITH TRANSPORTABLE EDGE RING FOR SUBSTRATE...

    • Publication number 20160284584
    • Publication date Sep 29, 2016
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Hsieh Chih-Chang
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    SEMICONDUCTOR APPARATUS WITH TRANSPORTABLE EDGE RING FOR SUBSTRATE...

    • Publication number 20140273505
    • Publication date Sep 18, 2014
    • Chih-Chang HSIEH
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...