Kai Lu

Person

Taoyuan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded packaging module and manufacturing method for the same
- Patent number 11,552,039
- Issue date Jan 10, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Zengsheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power module
- Patent number 11,435,797
- Issue date Sep 6, 2022
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power module and manufacturing method thereof
- Patent number 11,036,269
- Issue date Jun 15, 2021
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power package module of multiple power chips and method of manufact...
- Patent number 10,347,533
- Issue date Jul 9, 2019
- Delta Electronics (Shanghai) Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 10,136,545
- Issue date Nov 20, 2018
- Delta Electronics, Inc.
- Tao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and fabricating method thereof
- Patent number 10,128,181
- Issue date Nov 13, 2018
- Delta Electronics (Shanghai) Co., Ltd.
- Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package module of power conversion circuit and manufacturing method...
- Patent number 9,892,998
- Issue date Feb 13, 2018
- Delta Electronics, Inc.
- Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with the integration of control circuit
- Patent number 9,887,183
- Issue date Feb 6, 2018
- Delta Electronics, Inc.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package module and method of fabricating the same
- Patent number 9,806,010
- Issue date Oct 31, 2017
- Delta Electronics (Shanghai) Co., Ltd.
- Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding type power module
- Patent number 9,748,205
- Issue date Aug 29, 2017
- Delta Electronics, Inc.
- Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging module of power converting circuit and method for manufac...
- Patent number 9,679,786
- Issue date Jun 13, 2017
- Delta Electronics, Inc.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF POWER MODULE
- Publication number 20210200285
- Publication date Jul 1, 2021
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Shouyu Hong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200251438
- Publication date Aug 6, 2020
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Zengsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER PACKAGE MODULE OF MULTIPLE POWER CHIPS AND METHOD OF MANUFACT...
- Publication number 20190287943
- Publication date Sep 19, 2019
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Tao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20190138069
- Publication date May 9, 2019
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Shouyu Hong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20190043799
- Publication date Feb 7, 2019
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20170339798
- Publication date Nov 23, 2017
- Delta Electronics, Inc.
- Tao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20170133314
- Publication date May 11, 2017
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER PACKAGE MODULE OF MULTIPLE POWER CHIPS AND METHOD OF MANUFACT...
- Publication number 20170062386
- Publication date Mar 2, 2017
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Tao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT
- Publication number 20170012030
- Publication date Jan 12, 2017
- DELTA ELECTRONICS,INC.
- Tao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING TYPE POWER MODULE
- Publication number 20160381785
- Publication date Dec 29, 2016
- DELTA ELECTRONICS, INC.
- Kai LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MODULE AND METHOD OF FABRICATING THE SAME
- Publication number 20160365306
- Publication date Dec 15, 2016
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Kai LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING MODULE OF POWER CONVERTING CIRCUIT AND METHOD FOR MANUFAC...
- Publication number 20160254218
- Publication date Sep 1, 2016
- DELTA ELECTRONICS,INC.
- Shouyu HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MODULE OF POWER CONVERSION CIRCUIT AND MANUFACTURING METHOD...
- Publication number 20160254217
- Publication date Sep 1, 2016
- DELTA ELECTRONICS, INC.
- Kai LU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Embedded packaging module and manufacturing method for the same

Manufacturing method of power module

Power module and manufacturing method thereof

Power package module of multiple power chips and method of manufact...

Power module

Package structure and fabricating method thereof

Package module of power conversion circuit and manufacturing method...

Power module with the integration of control circuit

Package module and method of fabricating the same

Molding type power module

Packaging module of power converting circuit and method for manufac...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF POWER MODULE

EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME

POWER PACKAGE MODULE OF MULTIPLE POWER CHIPS AND METHOD OF MANUFACT...

POWER MODULE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

POWER MODULE

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

POWER PACKAGE MODULE OF MULTIPLE POWER CHIPS AND METHOD OF MANUFACT...

POWER MODULE WITH THE INTEGRATION OF CONTROL CIRCUIT

MOLDING TYPE POWER MODULE

PACKAGE MODULE AND METHOD OF FABRICATING THE SAME

PACKAGING MODULE OF POWER CONVERTING CIRCUIT AND METHOD FOR MANUFAC...

PACKAGE MODULE OF POWER CONVERSION CIRCUIT AND MANUFACTURING METHOD...