Kai Min

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Substrate to place components for camera size reduction
- Patent number 12,126,884
- Issue date Oct 22, 2024
- Apple Inc.
- Qi Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module flexure with segmented base layer
- Patent number 12,088,897
- Issue date Sep 10, 2024
- Apple Inc.
- Himesh Patel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Variable polyimide thickness to control pad impedance
- Patent number 11,962,881
- Issue date Apr 16, 2024
- Apple Inc.
- Himesh Patel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flex circuit arrangements for camera with sensor shift actuation
- Patent number 11,792,516
- Issue date Oct 17, 2023
- Apple Inc.
- Himesh Patel
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER