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Kai MINAMIZAKI

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  • Tokyo, JP
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Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20240253164
    • Publication date Aug 1, 2024
    • Disco Corporation
    • Akira MIZUTANI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20240234154
    • Publication date Jul 11, 2024
    • Disco Corporation
    • Kai MINAMIZAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20240136193
    • Publication date Apr 25, 2024
    • Disco Corporation
    • Kai MINAMIZAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20240082960
    • Publication date Mar 14, 2024
    • Disco Corporation
    • Satoshi KOBAYASHI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR