Kai-Ming CHIANG

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure
- Patent number 12,218,082
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device, package structure and fabricating method thereof
- Patent number 11,855,006
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 11,031,376
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsaing-Pin Kuan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240071954
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE
- Publication number 20240071953
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230317585
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Staggered Metal Mesh on Backside of Device Die and Method Forming Same
- Publication number 20230154764
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE, PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20230035212
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20210020607
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsaing-Pin Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150060119
- Publication date Mar 5, 2015
- National Tsing-Hua University
- Hao-Wu LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kai-Ming CHIANG

Person

Patents Grantslast 30 patents

Package structure

Memory device, package structure and fabricating method thereof

Chip package and method of forming the same

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Staggered Metal Mesh on Backside of Device Die and Method Forming Same

MEMORY DEVICE, PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

CHIP PACKAGE AND METHOD OF FORMING THE SAME

CONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREOF