Kai-Ming Ching

Person

Jhudong Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling channels in 3DIC stacks
- Patent number 9,859,252
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via bonding structure
- Patent number 9,673,174
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling channels in 3DIC stacks
- Patent number 9,355,933
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for 3D integrated circuit stacking
- Patent number 9,236,359
- Issue date Jan 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for 3D integrated circuit stacking
- Patent number 9,006,892
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via bonding structure
- Patent number 8,932,906
- Issue date Jan 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via for semiconductor device
- Patent number 8,703,609
- Issue date Apr 22, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical clock signal distribution using through-silicon vias
- Patent number 8,670,637
- Issue date Mar 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Cheng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling channels in 3DIC stacks
- Patent number 8,624,360
- Issue date Jan 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve bump reliability for flip chip device
- Patent number 8,497,584
- Issue date Jul 30, 2013
- Taiwan Semiconductor Manufacturing Company
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon vias and methods for forming the same
- Patent number 8,476,769
- Issue date Jul 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and process for the formation of TSVs
- Patent number 8,456,008
- Issue date Jun 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked-die packages
- Patent number 8,426,256
- Issue date Apr 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- C. W. Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for 3D integrated circuit stacking
- Patent number 8,309,396
- Issue date Nov 13, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit stacking-joint interface struc...
- Patent number 8,097,953
- Issue date Jan 17, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and process for the formation of TSVs
- Patent number 8,034,708
- Issue date Oct 11, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical clock signal distribution using through-silicon vias
- Patent number 8,005,326
- Issue date Aug 23, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Cheng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through-substrate via for semiconductor device
- Patent number 7,973,413
- Issue date Jul 5, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxless bumping process
- Patent number 7,906,425
- Issue date Mar 15, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Yuan Su
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and fabrication methods thereof
- Patent number 7,888,236
- Issue date Feb 15, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and process for the formation of TSVs
- Patent number 7,843,064
- Issue date Nov 30, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tapered through-silicon via structure
- Patent number 7,816,227
- Issue date Oct 19, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die wafer level packaging
- Patent number 7,785,927
- Issue date Aug 31, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a coil inductor
- Patent number 7,666,688
- Issue date Feb 23, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tapered through-silicon via structure
- Patent number 7,564,115
- Issue date Jul 21, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with a discontinuous material density for r...
- Patent number 7,557,423
- Issue date Jul 7, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die wafer level packaging
- Patent number 7,514,797
- Issue date Apr 7, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of impressed-current cathodic protection to prevent met...
- Patent number 7,468,321
- Issue date Dec 23, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of impressed-current cathodic protection to prevent met...
- Patent number 7,276,454
- Issue date Oct 2, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxless bumping process
- Patent number 7,134,199
- Issue date Nov 14, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Cooling Channels in 3DIC Stacks
- Publication number 20160276314
- Publication date Sep 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for 3D Integrated Circuit Stacking
- Publication number 20150214166
- Publication date Jul 30, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Silicon Via Bonding Structure
- Publication number 20150137328
- Publication date May 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Channels in 3DIC Stacks
- Publication number 20140103540
- Publication date Apr 17, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for 3D Integrated Circuit Stacking
- Publication number 20130062766
- Publication date Mar 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Process for the Formation of TSVs
- Publication number 20120001334
- Publication date Jan 5, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Clock Signal Distribution Using Through-Silicon Vias
- Publication number 20110299809
- Publication date Dec 8, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Cheng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH-SUBSTRATE VIA FOR SEMICONDUCTOR DEVICE
- Publication number 20110263120
- Publication date Oct 27, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Process for the Formation of TSVs
- Publication number 20110034027
- Publication date Feb 10, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED-DIE PACKAGES
- Publication number 20100279463
- Publication date Nov 4, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- C. W. Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for 3D Integrated Circuit Stacking
- Publication number 20100187684
- Publication date Jul 29, 2010
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Channels in 3DIC Stacks
- Publication number 20100117201
- Publication date May 13, 2010
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Integrated Circuit Stacking-Joint Interface Struc...
- Publication number 20100102453
- Publication date Apr 29, 2010
- Ming-Hong Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Silicon Via Bonding Structure
- Publication number 20100047963
- Publication date Feb 25, 2010
- Dean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Clock Signal Distribution Using Through-Silicon Vias
- Publication number 20100008620
- Publication date Jan 14, 2010
- Shih-Cheng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Tapered Through-Silicon Via Structure
- Publication number 20090269905
- Publication date Oct 29, 2009
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Coil Inductor
- Publication number 20090188104
- Publication date Jul 30, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and process for the formation of TSVs
- Publication number 20090160058
- Publication date Jun 25, 2009
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Wafer Level Packaging
- Publication number 20090155957
- Publication date Jun 18, 2009
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Silicon Vias and Methods for Forming the Same
- Publication number 20090102021
- Publication date Apr 23, 2009
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure with a Discontinuous Material Density for R...
- Publication number 20090057823
- Publication date Mar 5, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA FOR SEMICONDUCTOR DEVICE
- Publication number 20090051039
- Publication date Feb 26, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Wafer Level Packaging
- Publication number 20080296763
- Publication date Dec 4, 2008
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and fabrication methods thereof
- Publication number 20080286938
- Publication date Nov 20, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tapered through-silicon via structure
- Publication number 20080283959
- Publication date Nov 20, 2008
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluxless bumping process
- Publication number 20070028445
- Publication date Feb 8, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Yuan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION OF IMPRESSED-CURRENT CATHODIC PROTECTION TO PREVENT MET...
- Publication number 20060194407
- Publication date Aug 31, 2006
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel method to improve bump reliability for flip chip device
- Publication number 20040180296
- Publication date Sep 16, 2004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yen-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Application of impressed-current cathodic protection to prevent met...
- Publication number 20040087175
- Publication date May 6, 2004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluxless bumping process using ions
- Publication number 20040000580
- Publication date Jan 1, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Hui Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Kai-Ming Ching

Person

Patents Grantslast 30 patents

Cooling channels in 3DIC stacks

Through silicon via bonding structure

Cooling channels in 3DIC stacks

System and method for 3D integrated circuit stacking

System and method for 3D integrated circuit stacking

Through silicon via bonding structure

Through-substrate via for semiconductor device

Optical clock signal distribution using through-silicon vias

Cooling channels in 3DIC stacks

Method to improve bump reliability for flip chip device

Through-silicon vias and methods for forming the same

Structure and process for the formation of TSVs

Method of forming stacked-die packages

System and method for 3D integrated circuit stacking

Three-dimensional integrated circuit stacking-joint interface struc...

Structure and process for the formation of TSVs

Optical clock signal distribution using through-silicon vias

Through-substrate via for semiconductor device

Fluxless bumping process

Semiconductor device and fabrication methods thereof

Structure and process for the formation of TSVs

Tapered through-silicon via structure

Multi-die wafer level packaging

Method of manufacturing a coil inductor

Tapered through-silicon via structure

Semiconductor structure with a discontinuous material density for r...

Multi-die wafer level packaging

Application of impressed-current cathodic protection to prevent met...

Application of impressed-current cathodic protection to prevent met...

Fluxless bumping process

Patents Applicationslast 30 patents

Cooling Channels in 3DIC Stacks

System and Method for 3D Integrated Circuit Stacking

Through Silicon Via Bonding Structure

Cooling Channels in 3DIC Stacks

System and Method for 3D Integrated Circuit Stacking

Structure and Process for the Formation of TSVs

Optical Clock Signal Distribution Using Through-Silicon Vias

THROUGH-SUBSTRATE VIA FOR SEMICONDUCTOR DEVICE

Structure and Process for the Formation of TSVs

METHOD OF FORMING STACKED-DIE PACKAGES

System and Method for 3D Integrated Circuit Stacking

Cooling Channels in 3DIC Stacks

Three-Dimensional Integrated Circuit Stacking-Joint Interface Struc...

Through Silicon Via Bonding Structure

Optical Clock Signal Distribution Using Through-Silicon Vias

Tapered Through-Silicon Via Structure

Method of Manufacturing a Coil Inductor

Structure and process for the formation of TSVs

Multi-Die Wafer Level Packaging

Through-Silicon Vias and Methods for Forming the Same

Semiconductor Structure with a Discontinuous Material Density for R...

THROUGH-SUBSTRATE VIA FOR SEMICONDUCTOR DEVICE

Multi-Die Wafer Level Packaging

Semiconductor device and fabrication methods thereof

Tapered through-silicon via structure

Fluxless bumping process

APPLICATION OF IMPRESSED-CURRENT CATHODIC PROTECTION TO PREVENT MET...

Novel method to improve bump reliability for flip chip device

Application of impressed-current cathodic protection to prevent met...

Fluxless bumping process using ions