Kai-Shiang KUO

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer film device and method
- Patent number 12,166,128
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium-based liner for a copper interconnect
- Patent number 12,094,770
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally stable copper-alloy adhesion layer for metal interconnect...
- Patent number 12,080,594
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer alloy liner for interconnect metallization and methods of...
- Patent number 11,854,878
- Issue date Dec 26, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING LTD.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 11,777,035
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally stable copper-alloy adhesion layer for metal interconnect...
- Patent number 11,430,692
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 11,374,127
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method
- Patent number 11,328,952
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method
- Patent number 10,840,134
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 10,727,350
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method
- Patent number 10,269,627
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 10,199,500
- Issue date Feb 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming hybrid diffusion barrier layer and semiconductor...
- Patent number 9,812,397
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Shiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method
- Patent number 9,754,822
- Issue date Sep 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming hybrid diffusion barrier layer and semiconductor...
- Patent number 8,962,473
- Issue date Feb 24, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Shiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
- Publication number 20240395617
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER FILM DEVICE AND METHOD
- Publication number 20240395939
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT
- Publication number 20240387256
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...
- Publication number 20240350289
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun TSAI
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
- Publication number 20240079270
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER FILM DEVICE AND METHOD
- Publication number 20230369500
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT
- Publication number 20230068398
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...
- Publication number 20220367262
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bi-Layer Alloy Liner For Interconnect Metallization And Methods Of...
- Publication number 20220367265
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Film Device and Method
- Publication number 20220328690
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...
- Publication number 20220037203
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BI-LAYER LINER FOR METALLIZATION
- Publication number 20210202310
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method
- Publication number 20210074581
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Film Device and Method
- Publication number 20200357922
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method
- Publication number 20190252246
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Film Device and Method
- Publication number 20180350993
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Film Device and Method
- Publication number 20180040732
- Publication date Feb 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method
- Publication number 20170372948
- Publication date Dec 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD
- Publication number 20170256445
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING HYBRID DIFFUSION BARRIER LAYER AND SEMICONDUCTOR...
- Publication number 20150108649
- Publication date Apr 23, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Shiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING HYBRID DIFFUSION BARRIER LAYER AND SEMICONDUCTOR...
- Publication number 20140264867
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Kai-Shiang KUO
- H01 - BASIC ELECTRIC ELEMENTS

Kai-Shiang KUO

Person

Patents Grantslast 30 patents

Multi-layer film device and method

Ruthenium-based liner for a copper interconnect

Thermally stable copper-alloy adhesion layer for metal interconnect...

Bi-layer alloy liner for interconnect metallization and methods of...

Multi-layer film device and method

Thermally stable copper-alloy adhesion layer for metal interconnect...

Multi-layer film device and method

Interconnect structure and method

Interconnect structure and method

Multi-layer film device and method

Interconnect structure and method

Multi-layer film device and method

Method of forming hybrid diffusion barrier layer and semiconductor...

Interconnect structure and method

Method of forming hybrid diffusion barrier layer and semiconductor...

Patents Applicationslast 30 patents

Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...

MULTI-LAYER FILM DEVICE AND METHOD

RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT

THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...

Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...

MULTI-LAYER FILM DEVICE AND METHOD

RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT

THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...

Bi-Layer Alloy Liner For Interconnect Metallization And Methods Of...

Multi-Layer Film Device and Method

THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...

BI-LAYER LINER FOR METALLIZATION

Interconnect Structure and Method

Multi-Layer Film Device and Method

Interconnect Structure and Method

Multi-Layer Film Device and Method

Multi-Layer Film Device and Method

Interconnect Structure and Method

INTERCONNECT STRUCTURE AND METHOD

METHOD OF FORMING HYBRID DIFFUSION BARRIER LAYER AND SEMICONDUCTOR...

METHOD OF FORMING HYBRID DIFFUSION BARRIER LAYER AND SEMICONDUCTOR...