Kai Yun YOW

Person

Petaling Jaya, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate interconnections for packaged semiconductor device
- Patent number 9,997,445
- Issue date Jun 12, 2018
- NXP USA, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal BGA substrate
- Patent number 9,698,093
- Issue date Jul 4, 2017
- NXP USA,INC.
- Chee Seng Foong
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
IC device having patterned, non-conductive substrate
- Patent number 9,646,853
- Issue date May 9, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for alternative semiconductor die configurations
- Patent number 9,437,492
- Issue date Sep 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stress relief and heat spreader
- Patent number 9,196,576
- Issue date Nov 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with die attached heat spreader
- Patent number 9,165,855
- Issue date Oct 20, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold cap for semiconductor device
- Patent number 9,030,000
- Issue date May 12, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for semiconductor package with enhanced stress relief
- Patent number 8,836,091
- Issue date Sep 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor sensor device with over-molded lid
- Patent number 8,643,169
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of assembling pressure sensor device
- Patent number 8,501,517
- Issue date Aug 6, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- G01 - MEASURING TESTING
Information Patent Grant
Lead frame for semiconductor package
- Patent number 8,415,779
- Issue date Apr 9, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Tzu Ling Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self monitoring braking system for vehicles
- Patent number 8,078,353
- Issue date Dec 13, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor substrate and method of connecting semiconductor die...
- Patent number 7,868,449
- Issue date Jan 11, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die, integrated circuit package, and packaging m...
- Patent number 7,759,753
- Issue date Jul 20, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE INTERCONNECTIONS FOR PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20180114748
- Publication date Apr 26, 2018
- NXP USA, Inc.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DEVICE HAVING PATTERNED, NON-CONDUCTIVE SUBSTRATE
- Publication number 20170110339
- Publication date Apr 20, 2017
- FREESCALE SEMICONDUCTOR, INC.
- KAI YUN YOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL BGA SUBSTRATE
- Publication number 20170062320
- Publication date Mar 2, 2017
- FREESCALE SEMICONDUCTOR, INC.
- CHEE SENG FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR ALTERNATIVE SEMICONDUCTOR DIE CONFIGURATIONS
- Publication number 20160093533
- Publication date Mar 31, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER DICING BLADE
- Publication number 20150183131
- Publication date Jul 2, 2015
- Chee Seng Foong
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER
- Publication number 20150084169
- Publication date Mar 26, 2015
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR DEVICE AND ASSEMBLY METHOD
- Publication number 20150054099
- Publication date Feb 26, 2015
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR HAVING DOWN-SET FLAG
- Publication number 20150014793
- Publication date Jan 15, 2015
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD CAP FOR SEMICONDUCTOR DEVICE
- Publication number 20140367840
- Publication date Dec 18, 2014
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR PACKAGE WITH ENHANCED STRESS RELIEF
- Publication number 20140264793
- Publication date Sep 18, 2014
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20130113054
- Publication date May 9, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH EXPOSED PAD
- Publication number 20120074549
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun YOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR PACKAGE
- Publication number 20110248390
- Publication date Oct 13, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Tzu Ling WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED STAND-OFF
- Publication number 20110084375
- Publication date Apr 14, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng EU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS
- Publication number 20110068469
- Publication date Mar 24, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF MONITORING BRAKING SYSTEM FOR VEHICLES
- Publication number 20110066347
- Publication date Mar 17, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun YOW
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH DOWN-SET LEADS
- Publication number 20110062569
- Publication date Mar 17, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun YOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR SEMICONDUCTOR PACKAGE
- Publication number 20110012257
- Publication date Jan 20, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng EU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF CONNECTING SEMICONDUCTOR DIE...
- Publication number 20100295169
- Publication date Nov 25, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun YOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING BALL BOND
- Publication number 20100059883
- Publication date Mar 11, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Kai Yun YOW

Person

Patents Grantslast 30 patents

Substrate interconnections for packaged semiconductor device

Universal BGA substrate

IC device having patterned, non-conductive substrate

Substrate for alternative semiconductor die configurations

Semiconductor package with stress relief and heat spreader

Semiconductor device with die attached heat spreader

Mold cap for semiconductor device

Lead frame for semiconductor package with enhanced stress relief

Semiconductor sensor device with over-molded lid

Method of assembling pressure sensor device

Lead frame for semiconductor package

Self monitoring braking system for vehicles

Semiconductor substrate and method of connecting semiconductor die...

Integrated circuit die, integrated circuit package, and packaging m...

Patents Applicationslast 30 patents

SUBSTRATE INTERCONNECTIONS FOR PACKAGED SEMICONDUCTOR DEVICE

IC DEVICE HAVING PATTERNED, NON-CONDUCTIVE SUBSTRATE

UNIVERSAL BGA SUBSTRATE

SUBSTRATE FOR ALTERNATIVE SEMICONDUCTOR DIE CONFIGURATIONS

SEMICONDUCTOR WAFER DICING BLADE

SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER

PRESSURE SENSOR DEVICE AND ASSEMBLY METHOD

PRESSURE SENSOR HAVING DOWN-SET FLAG

MOLD CAP FOR SEMICONDUCTOR DEVICE

LEAD FRAME FOR SEMICONDUCTOR PACKAGE WITH ENHANCED STRESS RELIEF

SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME

SEMICONDUCTOR DEVICE WITH EXPOSED PAD

LEAD FRAME FOR SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED STAND-OFF

SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS

SELF MONITORING BRAKING SYSTEM FOR VEHICLES

SEMICONDUCTOR DEVICE PACKAGE WITH DOWN-SET LEADS

HEAT SPREADER FOR SEMICONDUCTOR PACKAGE

SEMICONDUCTOR SUBSTRATE AND METHOD OF CONNECTING SEMICONDUCTOR DIE...

METHOD OF FORMING BALL BOND