Kaichi Tsuruta

Person

Tochigi-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder ball, solder joint, and joining method
- Patent number 10,780,531
- Issue date Sep 22, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball, solder joint, and joining method
- Patent number 10,780,530
- Issue date Sep 22, 2020
- Senju Metal Industry Co., Ltd.
- Hiroki Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball supplying method, solder ball supplying device, and sol...
- Patent number 10,722,965
- Issue date Jul 28, 2020
- Senju Metal Industry Co., Ltd.
- Kaichi Tsuruta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining member, solder material, solder paste, formed solder, flux...
- Patent number 10,675,719
- Issue date Jun 9, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Flux applying device
- Patent number 10,391,589
- Issue date Aug 27, 2019
- Senju Metal Industry Co., Ltd.
- Manabu Muraoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux for resin flux cored solder, flux for flux coated solder, resi...
- Patent number 10,265,808
- Issue date Apr 23, 2019
- Senju Metal Industry Co., Ltd.
- Motohiro Onitsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid coating device
- Patent number 10,137,538
- Issue date Nov 27, 2018
- Senju Metal Industry Co., Ltd.
- Manabu Muraoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electrode for an energy storage device
- Patent number 10,121,606
- Issue date Nov 6, 2018
- Senju Metal Industry Co., Ltd.
- Katsuji Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solder transfer sheet, solder bump, and solder precoating method us...
- Patent number 10,111,342
- Issue date Oct 23, 2018
- Senju Metal Industry Co., Ltd.
- Kaichi Tsuruta
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Solder preform and a process for its manufacture
- Patent number 10,081,852
- Issue date Sep 25, 2018
- Senju Metal Industry Co., Ltd.
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder precoating method and workpiece for electronic equipment
- Patent number 9,821,397
- Issue date Nov 21, 2017
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electrode for an energy storage device
- Patent number 9,368,249
- Issue date Jun 14, 2016
- Senju Metal Industry Co., Ltd.
- Katsuji Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solder paste
- Patent number 8,961,709
- Issue date Feb 24, 2015
- Senju Metal Industry Co., Ltd.
- Kunihito Takaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump formation on a circuit board using a transfer sheet
- Patent number 8,701,973
- Issue date Apr 22, 2014
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder preform and electronic component
- Patent number 7,800,230
- Issue date Sep 21, 2010
- Denso Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder preform and a process for its manufacture
- Patent number 7,793,820
- Issue date Sep 14, 2010
- Senju Metal Industry Co., Ltd.
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball assembly for bump formation and method for its manufacture
- Patent number 7,112,888
- Issue date Sep 26, 2006
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball assembly, a method for its manufacture, and a method of...
- Patent number 6,919,634
- Issue date Jul 19, 2005
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum drying apparatus
- Patent number 5,377,425
- Issue date Jan 3, 1995
- Nikku Industry Co., Ltd.
- Osamu Kawakami
- F26 - DRYING

Patents Applicationslast 30 patents

Information Patent Application
Solder Ball, Solder Joint, and Joining Method
- Publication number 20200147732
- Publication date May 14, 2020
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY FOR BONDING CU PIPES AND/OR FE PIPES, PREFORM SOLDER,...
- Publication number 20190358751
- Publication date Nov 28, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Naoto KAMEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Ball, Solder Joint, and Joining Method
- Publication number 20190358752
- Publication date Nov 28, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Hiroki Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux Applying Device and Solder
- Publication number 20180185967
- Publication date Jul 5, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Manabu Muraoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Joining Member, Solder Material, Solder Paste, Formed Solder, Flux...
- Publication number 20180015572
- Publication date Jan 18, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Solder Transfer Sheet, Solder Bump, and Solder Precoating Method Us...
- Publication number 20170354042
- Publication date Dec 7, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Kaichi Tsuruta
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SOLDER ALLOY FOR PLATING AND ELECTRONIC COMPONENT
- Publication number 20170348805
- Publication date Dec 7, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Kaichi TSURUTA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Liquid Coating Device
- Publication number 20160346878
- Publication date Dec 1, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Manabu Muraoka
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Solder Ball Supplying Method, Solder Ball Supplying Device, and Sol...
- Publication number 20160271715
- Publication date Sep 22, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Kaichi Tsuruta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRODE FOR AN ENERGY STORAGE DEVICE
- Publication number 20160254103
- Publication date Sep 1, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Katsuji Nakamura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SOLDER TRANSFER SHEET
- Publication number 20160250719
- Publication date Sep 1, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Kaichi Tsuruta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux for Resin Flux Cored Solder, Flux for Flux Coated Solder, Resi...
- Publication number 20160184937
- Publication date Jun 30, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Motohiro Onitsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux for Flux-cored Solder, and Flux-cored Solder
- Publication number 20150000792
- Publication date Jan 1, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Takao Sugiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRODE FOR ENERGY STORAGE DEVICE, MANUFACTURING METHOD THEREOF A...
- Publication number 20130133924
- Publication date May 30, 2013
- SENJU METAL INDUSTRY CO., LTD.
- Katsuji Nakamura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET
- Publication number 20110297433
- Publication date Dec 8, 2011
- SENJU METAL INDUSTRY CO., LTD.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder preform and a process for its manufacture
- Publication number 20110068149
- Publication date Mar 24, 2011
- Senju Metal Industry Co., Ltd.
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Preform and Electronic Component
- Publication number 20090236725
- Publication date Sep 24, 2009
- DENSO Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder preform and a process for its manufacture
- Publication number 20080237301
- Publication date Oct 2, 2008
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Precoating Method and Workpiece For Electronic Equipment
- Publication number 20080213613
- Publication date Sep 4, 2008
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball assembly for bump formation and method for its manufacture
- Publication number 20040145064
- Publication date Jul 29, 2004
- Takeo Kuramoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball assembly, a method for its manufacture, and a method of...
- Publication number 20040070084
- Publication date Apr 15, 2004
- Takeo Kuramoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kaichi Tsuruta

Person

Patents Grantslast 30 patents

Solder ball, solder joint, and joining method

Solder ball, solder joint, and joining method

Solder ball supplying method, solder ball supplying device, and sol...

Joining member, solder material, solder paste, formed solder, flux...

Flux applying device

Flux for resin flux cored solder, flux for flux coated solder, resi...

Liquid coating device

Method of manufacturing an electrode for an energy storage device

Solder transfer sheet, solder bump, and solder precoating method us...

Solder preform and a process for its manufacture

Solder precoating method and workpiece for electronic equipment

Method of manufacturing an electrode for an energy storage device

Solder paste

Solder bump formation on a circuit board using a transfer sheet

Solder preform and electronic component

Solder preform and a process for its manufacture

Solder ball assembly for bump formation and method for its manufacture

Solder ball assembly, a method for its manufacture, and a method of...

Vacuum drying apparatus

Patents Applicationslast 30 patents

Solder Ball, Solder Joint, and Joining Method

SOLDER ALLOY FOR BONDING CU PIPES AND/OR FE PIPES, PREFORM SOLDER,...

Solder Ball, Solder Joint, and Joining Method

Flux Applying Device and Solder

Joining Member, Solder Material, Solder Paste, Formed Solder, Flux...

Solder Transfer Sheet, Solder Bump, and Solder Precoating Method Us...

SOLDER ALLOY FOR PLATING AND ELECTRONIC COMPONENT

Liquid Coating Device

Solder Ball Supplying Method, Solder Ball Supplying Device, and Sol...

METHOD OF MANUFACTURING AN ELECTRODE FOR AN ENERGY STORAGE DEVICE

SOLDER TRANSFER SHEET

Flux for Resin Flux Cored Solder, Flux for Flux Coated Solder, Resi...

Flux for Flux-cored Solder, and Flux-cored Solder

ELECTRODE FOR ENERGY STORAGE DEVICE, MANUFACTURING METHOD THEREOF A...

SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET

Solder preform and a process for its manufacture

Solder Preform and Electronic Component

Solder preform and a process for its manufacture

Solder Precoating Method and Workpiece For Electronic Equipment

Solder ball assembly for bump formation and method for its manufacture

Solder ball assembly, a method for its manufacture, and a method of...