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Kaichiro Nakao
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Himeji, JP
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last 30 patents
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Patent Grant
Aqueous polyamide resin dispersion and process for producing the same
Patent number
6,777,488
Issue date
Aug 17, 2004
Sumitomo Seika Chemicals Co., Ltd.
Eiichi Araki
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Patent Grant
Process for producing adhesive for fusion bonding, adhesive for fus...
Patent number
6,743,741
Issue date
Jun 1, 2004
Sumitomo Seika Chemicals Co., Ltd.
Eiichi Araki
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...